Tap flip flop, gate, and compare circuitry on rising SCK

ABSTRACT

The disclosure describes a novel method and apparatus for providing expected data, mask data, and control signals to scan test architectures within a device using the falling edge of a test/scan clock. The signals are provided on device leads that are also used to provide signals to scan test architectures using the rising edge of the test/scan clock. According to the disclosure, device test leads serve to input different test signals on the rising and falling edge of the test/scan clock which reduces the number of interconnects between a tester and the device under test.

This application is a divisional of prior application Ser. No.15/058,719, filed Mar. 2, 2016, now U.S. Pat. No. 9,638,753, issued May2, 2017;

Which was a divisional of prior application Ser. No. 14/636,892, filedMar. 3, 2015, now U.S. Pat. No. 9,316,692, granted Apr. 19, 2016;

Which was a divisional of prior application Ser. No. 13/953,184, filedJul. 29, 2013, now U.S. Pat. No. 9,003,250, granted Apr. 7, 2015;

Which is a divisional of prior application Ser. No. 13/486,474, filedJun. 1, 2012, now U.S. Pat. No. 8,522,098, granted Aug. 27, 2013;

Which is a divisional of prior application Ser. No. 13/238,674, filedSep. 21, 2011, now U.S. Pat. No. 8,225,158, granted Jul. 17, 2012;

Which is a divisional of prior application Ser. No. 12/410,561, filedMar. 25, 2009, now U.S. Pat. No. 8,046,651, granted Oct. 25, 2011;

Which claims priority from Provisional Application No. 61/041,767, filedApr. 2, 2008,

and also claims priority from Provisional Application No. 61/061,292,filed Jun. 13, 2008.

FIELD OF THE DISCLOSURE

This disclosure relates in general to device scan architectures and inparticular to device scan test architectures that use the falling edgeof scan clocks to input mask data, expected data, and scan enablesignals during test.

BACKGROUND OF THE DISCLOSURE

Most electrical devices today, which may be ICs or embedded cores withinICs, use scan test architectures to test combinational logic within thedevices. Scan test architectures within a device comprise scan pathshaving externally accessible scan inputs, externally accessible controlinputs and externally accessible scan outputs. Alternately, scan testarchitectures within a device may comprise scan paths having externallyaccessible scan inputs, externally accessible control inputs and scanoutputs that are internally coupled to a compare circuit within thedevice for comparing the scan outputs with externally accessibleexpected data inputs. Further, scan test architectures within a devicemay comprise scan paths having externally accessible scan inputs,externally accessible control inputs and scan outputs internally coupledto a compressor circuit within the device for compressing unmasked scanoutputs into a signature. The masking or unmasking of a scan output tothe compressor circuit is provided by externally accessible mask datainputs to the circuit.

The expected data inputs to the compare circuit and the mask data inputsto the compressor circuit are provided by additional signal inputs tothe device. Requiring a device to have additional inputs for theexpected and mask data increases the number of interconnects between thedevice and a tester. This increase in interconnect increases the cost ofthe tester, which is reflected in the cost of the device being tested.The present disclosure advantageously provides a way to eliminate theneed for a device to have additional inputs for expected and mask datafrom a tester by allowing the expected and mask data signals to be inputto the device from the tester using the scan data inputs of the device.Additional features of the present disclosure, beyond the elimination ofexpected and mask data inputs, will be described in detail below.

BRIEF SUMMARY OF THE DISCLOSURE

The disclosure provides an improved way to scan test circuits in adevice by utilizing the falling edge of the scan clock to input expecteddata, mask data and/or test control signals to the device. The expecteddata, mask data and/or test control signals are advantageously input tothe device using the same device test leads that input test signals tothe scan test circuits on the rising edge of the scan clock.

BRIEF DESCRIPTION OF THE VIEWS OF THE DRAWINGS

FIG. 1A illustrates a conventional scan architecture within a device.

FIG. 1B illustrates the operation of the FIG. 1A scan architecture.

FIG. 2 illustrates a conventional parallel scan architecture within adevice.

FIG. 3 illustrates a parallel arrangement between a tester and pluraldevices to be tested using the scan architectures of FIGS. 1 and 2.

FIG. 4A illustrates a scan test architecture that uses an internalcompare circuit and expected data inputs.

FIG. 4B illustrates an example compare circuit having expected datainputs.

FIG. 4C illustrates the operation of the FIG. 4 scan test architecture.

FIG. 5A illustrates a scan test architecture that uses an internalcompressor circuit and mask data inputs.

FIG. 5B illustrates an example compressor circuit having mask datainputs.

FIG. 5C illustrates the operation of the FIG. 5A scan test architecture.

FIG. 6 illustrates a parallel arrangement between a tester and pluraldevices to be tested using the scan architectures of FIGS. 4 and 5.

FIG. 7A illustrates a scan architecture using a comparator and expecteddata inputs according to the disclosure.

FIG. 7B illustrates the operation of the FIG. 7A scan architecture.

FIG. 8A illustrates a scan architecture using a compressor and mask datainputs according to the disclosure.

FIG. 8B illustrates the operation of the FIG. 8A scan architecture.

FIG. 9 illustrates a parallel arrangement between a tester and pluraldevices to be tested using the scan architectures of FIGS. 7 and 8.

FIG. 10 illustrates a scan architecture using a comparator, expecteddata inputs, and test access port (TAP) according to the disclosure.

FIG. 11 illustrates a scan architecture using a compressor, mask datainputs, and a TAP according to the disclosure.

FIG. 12 illustrates a conventional TAP architecture.

FIG. 13 illustrates the state diagram of the TAP state machine.

FIG. 14A illustrates a simplified view of the TAP state machine.

FIG. 14B illustrates transitions through the TAP state machine diagramduring scan operations.

FIG. 15A illustrates a scan architecture using a comparator, expecteddata inputs, a TAP, and gating to allow improved scan operationsaccording to the disclosure.

FIG. 15B illustrates the operation of the FIG. 15A scan architecture.

FIG. 16A illustrates a scan architecture using a compressor, mask datainputs, a TAP, and gating to allow improved scan operations according tothe disclosure.

FIG. 16B illustrates the operation of the FIG. 16A scan architecture.

FIG. 17A illustrates a single scan register architecture using acomparator or compressor, expected or mask data inputs, and a TAPaccording to the disclosure.

FIG. 17B illustrates the operation of the FIG. 17A scan architecture.

FIG. 18A illustrates another single scan register architecture using acomparator or compressor, expected or mask data inputs, and a TAPaccording to the disclosure.

FIG. 18B illustrates the operation of the FIG. 18A scan architecture.

FIG. 19A illustrates a single scan register architecture using acomparator or compressor, expected or mask data inputs, a TAP, andgating to allow improved scan operations according to the disclosure.

FIG. 19B illustrates the operation of the FIG. 19A scan architecture.

FIG. 20A illustrates another single scan register architecture using acomparator or compressor, expected or mask data inputs, a TAP, andgating to allow improved scan operations according to the disclosure.

FIG. 20B illustrates the operation of the FIG. 20A scan architecture.

FIG. 21A illustrates a single scan register architecture using acomparator, expected data input, mask data input, and a TAP according tothe disclosure.

FIG. 21B illustrates an example comparator circuit having expected andmask data inputs.

FIG. 21C illustrates the operation of the FIG. 21A scan architecture.

FIG. 22A illustrates another single scan register architecture using acomparator, expected data input, mask data input, and a TAP according tothe disclosure.

FIG. 22B illustrates the operation of the FIG. 22A scan architecture.

FIG. 23A illustrates a single scan register architecture using a TAP andgating to allow improved scan operations according to the disclosure.

FIG. 23B illustrates the operation of the FIG. 23A scan architecture.

FIG. 24A illustrates another single scan register architecture using aTAP and gating to allow improved scan operations according to thedisclosure.

FIG. 24B illustrates the operation of the FIG. 24A scan architecture.

FIG. 25A illustrates a parallel scan register architecture using a TAPand gating to allow improved scan operations according to thedisclosure.

FIG. 25B illustrates the operation of the FIG. 25A scan architecture.

FIG. 26 illustrates a parallel arrangement between a tester and pluraldevices to be tested using the scan architectures of FIGS. 23, 24, and25.

FIG. 27 illustrates a serial arrangement between a tester and pluraldevices to be tested using the scan architectures of FIGS. 23, 24, and25.

FIG. 28 illustrates a general scan test architecture interfaced to a TAPand gating to allow improved scan operations according to thedisclosure.

FIG. 29A illustrates a scan test architecture using a decompressor andcompactor circuit that could be substituted for the general scan testarchitecture of FIG. 28 according to the disclosure.

FIG. 29B illustrates an example compactor circuit for FIG. 29A.

FIG. 30A illustrates another scan test architecture using a decompressorand compactor circuit that could be substituted for the general scantest architecture of FIG. 28 according to the disclosure.

FIG. 30B illustrates an example compactor circuit for FIG. 30A.

FIG. 31 illustrates a scan test architecture using a decompressor,compactor, and compressor circuit that could be substituted for thegeneral scan test architecture of FIG. 28 according to the disclosure.

FIG. 32 illustrates another scan test architecture using a decompressor,compactor and compressor circuit that could be substituted for thegeneral scan test architecture of FIG. 28 according to the disclosure.

FIG. 33A illustrates a scan test architecture using a decompressor andmaskable compactor that could be substituted for the general scan testarchitecture of FIG. 28 according to the disclosure.

FIG. 33B illustrates an example maskable compactor for use in FIG. 31.

FIG. 33C illustrates another example maskable compactor for use in FIG.31.

FIG. 33D illustrates an example mask shift register (MSR) for use inFIG. 33C.

FIG. 34 illustrates a scan test architecture using a decompressor,maskable compactor, and compressor circuit that could be substituted forthe general scan test architecture of FIG. 28 according to thedisclosure.

FIG. 35A illustrates a scan test architecture using a decompressor,compactor, and masking circuitry that could be substituted for thegeneral scan test architecture of FIG. 28 according to the disclosure.

FIG. 35B illustrates the operation of the FIG. 35A scan architecture.

FIG. 36 illustrates a scan test architecture using a decompressor,compactor, masking circuitry, and compressor circuit that could besubstituted for the general scan test architecture of FIG. 28 accordingto the disclosure.

FIG. 37A illustrates the general scan test architecture of FIG. 28 beingcontrolled by a TAP interface according to the disclosure.

FIG. 37B illustrates the general scan test architecture of FIG. 28 beingcontrolled by a scan control interface according to the disclosure.

FIG. 38A illustrates an example single input maskable compactor thatallows inputting multiple mask patterns during shift operationsaccording to the disclosure.

FIG. 38B illustrates timing of inputting a mask pattern into thecompactor of FIG. 38A.

FIG. 38C illustrates the inputting multiple mask patterns to thecompactor of FIG. 38A during a scan cycle shift operation according tothe disclosure.

FIG. 39A illustrates another example single input maskable compactorthat allows inputting multiple mask patterns during shift operationsaccording to the disclosure.

FIG. 39B illustrates timing of inputting a mask pattern into thecompactor of FIG. 39A.

FIG. 40A illustrates an example multiple input maskable compactor thatallows inputting multiple mask patterns during shift operationsaccording to the disclosure.

FIG. 40B illustrates timing of inputting a mask pattern into thecompactor of FIG. 40A.

FIG. 41A illustrates another example multiple input maskable compactorthat allows inputting multiple mask patterns during shift operationsaccording to the disclosure.

FIG. 41B illustrates timing of inputting a mask pattern into thecompactor of FIG. 41A.

DETAILED DESCRIPTION OF THE DISCLOSURE

FIG. 1A illustrates a conventional method of using a scan register 104to test combinational logic 106 in a device. The scan register has aserial data input (SDI), a serial data output (SDO), scan clock input(SCK), a scan enable input (SEN), parallel outputs 108 coupled toparallel inputs to the combinational logic, and parallel inputs 110coupled to parallel outputs from the combinational logic. The SDI, SDO,SCK and SEN device signals are coupled to a tester.

FIG. 1B illustrates the timing of a tester operating the scan registerof FIG. 1A to input test stimulus to the combinational logic and outputtest response from the combinational logic. When SEN goes low, responsedata is captured into the scan register on the rising edge of SCK. WhenSEN goes high, the scan register shifts data from SDI to SDO on therising edge of SCK. The shift and capture logic levels on SEN could bereversed if desired. The shift operation unloads the captured responseand loads the next stimulus data to be applied to the combinationallogic. This process of capturing response data and shifting the scanregister repeats until the test is complete. Scan testing, as shown inFIG. 1, is well known in the industry.

FIG. 2 illustrates a conventional method of using a parallel group ofthe scan registers 104 of FIG. 1 to test combinational logic 106 in adevice 202. Each scan register 1-N is coupled to an associated SDI 1-Ninput and SDO 1-N output of a tester. Also each scan register 1-N iscoupled to SCK and SEN signals of the tester and to the combinationallogic via parallel outputs 108 and parallel inputs 110. Parallel scantesting, as shown in FIG. 2, is well known in the industry.

FIG. 3 illustrates a conventional arrangement between a tester 302 and agroup of FIG. 2 devices 202 to be tested in parallel. The tester has anoutput bus 304 for outputting the SDI 1-N signals to all devices 202.The tester has input buses 306-312 for inputting the SDO 1-N signalsfrom each device 202. The tester needs only a single output bus 304 tooutput the SDI 1-N signals to each device 202 being tested in parallelsince each device 202 receives the same SDI 1-N signals. However, thetester requires a separate input bus 306-312 for each device 202 toallow the SDO 1-N outputs of each device 202 to be separately input tothe tester. While not shown, the tester also outputs SCK and SEN signalsto all devices to operate the scan registers 104. Requiring the testerto have a separate input bus 306-312 for each device being tested inparallel increases the cost of the tester and, as a result, the cost ofeach device.

FIG. 4A illustrates a scan test architecture whereby a compare circuit404 is placed in a device 402. The scan test architecture of FIG. 4A isthe same as that of FIG. 2 with the exception that the compare circuit404 has been added. For simplicity, the combinational logic is not shownin FIG. 4A. However, each scan register 104 is coupled to combinationallogic via its parallel inputs 110 and outputs 108 as previouslydescribed in regard to FIG. 2. The compare circuit 404 is coupled to theSDO 1-N outputs of each scan register 1-N, the SCK and SEN signals, andexternally accessible expected data 1-N (EDI 1-N) signals. The comparecircuit 404, in this example, is also coupled to an externallyaccessible JTAG test data input (TDI) signal and test data output (TDO)signal to allow shifting out the test results stored in compare circuit404. The compare circuit 404 operates in response to the SCK and SENsignals to compare the SDO 1-N outputs of each scan register 1-N 104with an expected data input 1-N (EDI 1-N) from the tester. The comparecircuit 404 eliminates the need for the device 402 to output SDO 1-Nsignals from scan registers 1-N to the tester. However, and as seen, anEDI 1-N input from the tester is required for each SDO 1-N output fromthe scan registers 104.

FIG. 4B illustrates one example implementation of compare circuit 404.The compare circuit includes a comparing circuit 406, such as an XORgate, that inputs an SDO signal from a scan register 104 and an EDIsignal from a tester and outputs a comparison signal to a memory circuit(M) 408. The memory circuit 408 operates in response to the SCK and SENsignals to evaluate the comparison results from the comparing circuit406 during the test. At the end of the test, the test comparison resultscan be accessed via a JTAG TDI to TDO signal path. The compare circuit408 can be of any complexity. For example the compare circuit 408 can beas simple as a flip flop that latches a state upon the first detectionof a failure or the compare circuit 408 can be more sophisticated,perhaps including a multiple fail detection memory latches and a failurelogging circuit that indicates which compare operation failed.

FIG. 4C illustrates the timing of a tester operating the scan registers104 and compare circuit 404 to test combinational logic. When SEN goeslow, response data is captured into the scan registers 104 on the risingedge of SCK. When SEN goes high, the scan registers shift (SFT) datafrom SDI to SDO on the rising edge of SCK while the compare circuit 404compares (CMP) the SDO 1-N data outputs from the scan registers againstEDI 1-N data signals from the tester. This process of capturing responsedata, shifting the scan registers and comparing their SDO outputsrepeats until the test is complete. At the end of the test, the testresults stored in the memory circuit 408 can be shifted out to thetester for examination via the JTAG TDI and TDO scan path.

FIG. 5A illustrates a scan test architecture whereby a compressorcircuit 504 is placed in a device 502. The scan test architecture ofFIG. 5A is similar to that of FIG. 4A with the exception that thecompressor circuit 504 is used instead of the compare circuit 404. Aswith FIG. 4A, the combinational logic being tested is not shown in FIG.5A. The compressor circuit 504 is coupled to the SDO 1-N outputs of eachscan register 1-N, the SCK and SEN signals, and externally accessiblemask data 1-N (MDI 1-N) signals. The compressor circuit 504, in thisexample, is also coupled to an externally accessible JTAG test datainput (TDI) signal and test data output (TDO) signal to allow shiftingout the test results stored in compressor circuit 504. The compressorcircuit 504 operates in response to the SCK and SEN signals to compressthe SDO 1-N outputs of each scan register 1-N 104 into a signature usedto determine if the test passes or fails. Since some of the SDO responsesignals from the scan registers may be unknown signals, a MDI 1-N signalfrom the tester is associated with each SDO 1-N output signal and inputto the compressor 504. The MDI 1-N signals are used to mask off unknownSDO 1-N response signals so that those SDO signals will not have aneffect on the test signature being taken. The compressor circuit 504eliminates the need for the device 502 to output SDO 1-N signals fromscan registers 1-N to the tester. However, and as seen, a MDI 1-N inputfrom the tester is required for each SDO 1-N output from the scanregisters 104.

FIG. 5B illustrates one example implementation of compressor circuit504. The compressor circuit includes a masking gate 506, such as an ORgate, that inputs an SDO signal from a scan register 104 and a MDIsignal from a tester and outputs a signal to a compression circuit (C)508. If the SDO input to gate 506 is not masked by the MDI input, theoutput of the gate will be the same as the SDO input to the gate. If thegate is masked by the MDI input, the output of the gate 506 will be setto a predetermined logic state that is independent of the SDO input. Thecompression circuit 508 operates in response to the SCK and SEN signalsto compress unmasked SDO 1-N inputs into a signature during the test. Atthe end of the test, the test signature can be accessed via the TDI andTDO signals. The compression circuit 508 can be of any known type suchas but not limited to a multiple input shift register (MISR).

FIG. 5C illustrates the timing of a tester operating the scan registers104 and compressor circuit 504 to test combinational logic. When SENgoes low, response data is captured into the scan registers 104 on therising edge of SCK. When SEN goes high, the scan registers shift (SFT)data from SDI to SDO on the rising edge of SCK while the compressorcircuit 504 compresses (CMP) the unmasked SDO 1-N data outputs from thescan registers. This process of capturing response data, shifting thescan registers and compressing their unmasked SDO outputs repeats untilthe test is complete. At the end of the test, the test signaturecollected in the compression circuit 508 can be shifted out to thetester for examination via the JTAG TDI and TDO scan path.

FIG. 6 illustrates a conventional arrangement between a tester 602 and agroup of devices 604 to be tested in parallel. The devices 604 could bea group of devices 402 of FIG. 4 or a group of device 502 of FIG. 5. Thetester has a first output bus 606 for outputting the SDI 1-N signals toall devices 604. The tester has a second output bus 608 for outputtingEDI 1-N signals or MDI 1-N signals to all devices 604. If the devices604 are devices 402 of FIG. 4, output bus 608 will be used to output EDI1-N signals to the devices. If the devices 604 are device 502 of FIG. 5,output bus 608 will be used to output MDI 1-N signals to the devices.The tester also has a JTAG TDI output 610 to a first device in the groupand a JTAG TDO input 612 from the last device in the group. TDI to TDOconnections are formed between the devices to provide the tester with aJTAG scan path through all the devices 604 in the group for unloadingtest compare results from device compare circuits 404 or to unload testsignatures from device compressor circuits 504. While not shown, thetester also outputs JTAG control signals TCK and TMS to all devices tooperate the TDI to TDO scan path and SCK and SEN signals to all devicesto operate the scan registers 104 and compare/compressor circuits404/504.

As seen in FIG. 6 and due to the scan test architecture implemented inthe devices 604, the tester only needs the two buses 606 and 608 and theJTAG TDI 610 to TDO 612 scan path signals to test all the devices 604 inthe group in parallel. Bus 606 is used input the SDI 1-N signals to alldevices 604 and bus 608 is used to input the EDI 1-N or MDI 1-N signalsto all devices 604. Thus the test arrangement between the tester anddevices being tested in FIG. 6 is superior to the test arrangement ofFIG. 3 in reducing the number of interconnects between the tester anddevices. Reducing the interconnects between the tester and devices leadsto less expensive testers and therefore a reduction in the cost of thedevices being tested. However, it would be even more advantageous,cost-wise, if the number of interconnects between the tester and thedevices could be further reduced. For example if bus 606 and bus 608each comprise 64 separate signals, 128 interconnects are requiredbetween the tester and devices. The present disclosure as describedbelow provides, among other embodiments, a method and apparatus forallowing the signals of bus 608 to be transmitted on bus 606. Thus theexample 128 interconnects above between the tester and devices beingtested can be further reduced by the present disclosure to only 64interconnects between the tester and devices being tested.

FIG. 7A illustrates an embodiment of the disclosure in a device 702. Asseen, the disclosure improves upon the scan test architecture of FIG. 4by placing flip flops (FF) 704 on each SDI 1-N device input. The datainput of each FF is coupled to an associated SDI 1-N input from thetester. The clock input of each FF 704 is coupled to the SCK input fromthe tester via inverter 706. The data output of each FF 704 is coupledto an EDI 1-N input to compare circuit 404. As can be appreciated, thisembodiment of the disclosure enables the EDI 1-N data inputs to thedevice 702 to now be provided by the SDI 1-N data inputs to the device702, instead of by the separate EDI 1-N inputs to the device 402 of FIG.4.

As seen in the timing diagram of FIG. 7B, the tester inputs SDI data tothe scan registers on the rising edge of SCK and EDI data to the FFs onthe falling edge of SCK. The EDI outputs from the FFs are input to thecomparators to be compared with the SDO outputs from the scan registersas described in FIG. 4. Inputting the EDI data on the falling edge ofSCK is transparent to the normal SDI data input on the rising edge ofSCK. Thus the disclosure maintains the capture and shift/compareoperations of the scan approach of the FIG. 4 device while eliminatingthe need for the FIG. 4 device to have separate inputs for inputting theEDI data, which advantageously reduces the number of connection betweenthe device and tester.

FIG. 8A illustrates an embodiment of the disclosure in a device 802. Asseen, the disclosure improves upon the scan test architecture of FIG. 5by placing flip flops (FF) 704 on each SDI 1-N device input. The datainput of each FF is coupled to an associated SDI 1-N input from thetester. The clock input of each FF 704 is coupled to the SCK input fromthe tester via inverter 706. The data output of each FF 704 is coupledto a MDI 1-N input to compressor circuit 504. As can be appreciated,this embodiment of the disclosure enables the MDI 1-N data inputs to thedevice 802 to now be provided by the SDI 1-N data inputs to the device802, instead of by the separate MDI 1-N inputs to the device 502 of FIG.5.

As seen in the timing diagram of FIG. 8B, the tester inputs SDI data tothe scan registers on the rising edge of SCK and MDI data to the FFs onthe falling edge of SCK. The MDI outputs from the FFs are input to thecompressor circuit to be used to mask the SDO outputs from the scanregisters as described in FIG. 5. Inputting the MDI data on the fallingedge of SCK is transparent to the normal SDI data input on the risingedge of SCK. Thus the disclosure maintains the capture andshift/compress operations of the scan approach of the FIG. 5 devicewhile eliminating the need for the FIG. 5 device to have separate inputsfor inputting the MDI data, which advantageously reduces the number ofconnection between the device and tester.

FIG. 9 illustrates an arrangement between a tester 902 and a group ofdevices 904 to be tested in parallel, according the disclosure. Thedevices 904 could be a group of devices 702 of FIG. 7 or a group ofdevice 802 of FIG. 8. The tester has an output bus 906 for outputtingthe SDI 1-N signals and EDI 1-N or MDI 1-N signals to all devices 604.Tester 902 is the same as the tester 602 of FIG. 6 with the exceptionthat it has been designed to output SDI data to the devices 904 forinput to the device scan registers 104 on the rising edge of SCK and EDIor MDI data to the devices 904 for input to the FFs 704 on the fallingedge of SCK. Bus 906 is the same as bus 606 of FIG. 6 with the exceptionthat each signal of bus 906 provides both an SDI 1-N signal and an EDI1-N or MDI 1-N signal to each device 904. If the devices 904 are devices702 of FIG. 7, output bus 906 will be used to output SDI and EDI signalsto the devices. If the devices 904 are devices 802 of FIG. 8, output bus906 will be used to output SDI and MDI signals to the devices. As withFIG. 6, the tester 902 has a JTAG TDI output 610 to a first device inthe group and a JTAG TDO input 612 from the last device in the group.TDI to TDO connections are formed between the devices to provide thetester with a JTAG scan path through all the devices 904 in the groupfor unloading test compare results from device compare circuits 404 orto unload test signatures from device compressor circuits 504. While notshown, the tester also outputs JTAG control signals TCK and TMS to alldevices to operate the TDI to TDO scan path and SCK and SEN signals toall devices to operate the scan registers 104 and compare/compressorcircuits 404/504.

As seen in FIG. 9 and due to the scan test architecture implemented inthe devices 904, the tester only needs one bus 906 and the JTAG TDI 610to TDO 612 scan path signals to test all the devices 904 in the group inparallel. As previously mentioned and while not shown, the tester alsooutputs JTAG control signals TCK and TMS to all devices to operate theTDI to TDO scan path and SCK and SEN signals to all devices to operatethe scan registers 104 and compare/compressor circuits 404/504. Thus thetest arrangement between the tester and devices being tested in FIG. 9is superior to the test arrangement of FIG. 6 in reducing the number ofinterconnects between the tester and devices. As mentioned, reducing theinterconnects between the tester and devices leads to less expensivetesters and therefore a reduction in the cost of the devices beingtested. Using the same 64 signal bus width example of FIG. 6, theinterconnects between the tester 902 and devices 904 of FIG. 9 arereduced from 128 for the two bus arrangement of FIG. 6 to only 64 forthe single bus arrangement of FIG. 9. Also the test time to test thedevices 904 of FIG. 9 is the same as the test time to test the devices604 of FIG. 6, since the inputting of EDI or MDI data on bus 906 on thefalling edge of SCK takes no additional time.

FIG. 10 illustrates an embodiment of the disclosure in a device 1002. Asseen, the device 1002 uses a JTAG test access port (TAP) 1004 to providecontrol to the scan test architecture of FIG. 7. The JTAG TAP isdescribed in detail in IEEE standard 1149.1. The scan test architectureof FIG. 10 is the same as FIG. 7 with the exception that the TAP 1004 isused to control the SCK and SEN signals instead of SCK and SEN signalsbeing controlled directly by a tester. The device TAP 1004 is coupled toa tester via a test mode select (TMS) signal and a test clock (TCK)signal, and to the scan registers 104 and compare circuit 404 via theSCK and SEN signals. In this example, the clock inputs to FFs 704 arecoupled to the TCK signal via inverter 706. As seen in dotted line, theclock input to the FFs 704 could be coupled to the SCK output from theTAP via an inverter 706 instead of to the TCK via an inverter 706 ifdesired. It is assumed at this point that all devices of this disclosurethat include a TAP and FFs may clock the FFs using either the TCK inputto the device or the SCK clock output from the TAP of the device. TheSCK and SEN signals from TAP 1004 control the scan test architecture aspreviously described in FIG. 7, i.e. when SEN is low, response data fromcombinational logic is captured into scan registers 104 on the risingedge of SCK and when SEN is high, the scan registers 104 shift data fromSDI 1-N to SDO 1-N on the rising edge of SCK while the compare circuit404 compares the SDO 1-N data from the scan registers against EDI 1-Ndata from FFs 704 on the rising edge of SCK. The TAP 1004 is also usedto operate the TDI to TDO scan path through compare circuit 404 tounload the test compare results at the end of test.

FIG. 11 illustrates an embodiment of the disclosure in a device 1102. Asseen, the device 1102 uses a JTAG TAP 1004 to provide control to thescan test architecture of FIG. 8. The scan test architecture of FIG. 11is the same as FIG. 8 with the exception that the TAP 1004 is used tocontrol the SCK and SEN signals instead of SCK and SEN signals beingcontrolled directly by a tester. The device TAP 1004 is coupled to atester via the TMS and TCK signals, and to the scan registers 104 andcompressor circuit 504 via the SCK and SEN signals. As with the scantest architecture of FIG. 10, the clock inputs to FFs 704 are coupled tothe TCK signal via inverter 706, but as mentioned the clock input to theFFs 704 could be coupled to the SCK output from the TAP via an inverter706 if desired. The SCK and SEN signals from TAP 1004 control the scantest architecture as previously described in FIG. 8, i.e. when SEN islow, response data from combinational logic is captured into scanregisters 104 on the rising edge of SCK and when SEN is high, the scanregisters 104 shift data from SDI 1-N to SDO 1-N on the rising edge ofSCK while the compressor circuit 504 compresses masked and unmasked SDO1-N data from the scan registers into a signature on the rising edge ofSCK. The TAP 1004 is also used to operate the TDI to TDO scan paththrough compressor circuit 504 to unload the test signature at the endof test.

Using a JTAG TAP 1004 to control the scan test architectures of FIGS. 10and 11 introduces an undesired delay between when response data can becaptured into scan registers 104 at the end of a scan register shiftoperation, as will be described in regard to FIGS. 12, 13, 14 and 14Abelow.

FIG. 12 illustrates a simplified view of the test architecture definedin the IEEE standard 1149.1 Test Access Port and Boundary ScanArchitecture (JTAG) in a device 1202. The JTAG architecture comprises aTAP state machine (TSM) 1204, an instruction register 1206, andselectable data registers 1208. TSM 1204 is controlled by TMS and TCKinputs to perform shift operations through the instruction register 1206or through a selected data register 1208 from TDI to TDO. The JTAGarchitecture of FIG. 12 is well known in the industry.

FIG. 13 illustrates the operational state diagram of TSM 1204 whichcomprises the 16 states shown. This TSM state diagram is well known inthe industry. When the TSM is not performing an instruction or dataregister shift operation it can be placed in a Test Logic Reset state1302 or a Run Test/Idle state 1304. Instruction and data register shiftoperations are symmetrical in that they both have Capture states 1308 &1322, shift states 1310 & 1324, Exit1 states 1312 & 1326, Pause states1314 & 1328, Exit2 states 1316 & 1330, and Update states 1318 & 1332.Data register shift operations are selected by the Select-DR state 1306.Instruction register shift operations are selected by the Select-IRstate 1320. The above mentioned undesired delay between when data can becaptured following a shift operation can be seen in the number of statetransitions it takes to enter the Capture-DR state 1308 after existingfrom the Shift-DR state 1310. FIGS. 14 and 14A are provided toillustrate this undesired capture delay in more detail.

FIG. 14A illustrates a simplified TSM 1402 having standard TMS and TCKinputs and ClockDR 1404 and ShiftDR 1406 outputs. TSM 1402 hasadditional standard outputs, but only the standard ClockDR 1404 andShiftDR 1406 outputs are required to illustrate the undesired capturedelay problem. As seen, the ClockDR output 1404 can be coupled to driveSCK as shown in FIGS. 10 & 11 and the ShiftDR output 1406 can be coupledto drive SEN as shown in FIGS. 10 & 11. In most cases, the coupling ofClockDR to SCK and ShiftDR to SEN is performed by an instruction loadedinto the instruction register 1206 of the JTAG architecture of FIG. 12.

FIG. 14B illustrates the timing of using the TSM 1402 to perform a dataregister shift operation when SEN is coupled to the TSM ShiftDR signal1406 and SCK is coupled to the TSM ClockDR signal 1404. As seen, the TSMtransitions into the Select-DR state 1306 on the rising edge of TCK1408, the TSM transitions to the Capture-DR state 1308 on the risingedge of TCK 1410, the TSM transitions to the Shift-DR state 1310 andperforms the capture operation on the rising edge of TCK 1412 via SCK1413, the TSM remains in Shift-DR state 1310 shifting data during TCKs1414-1416 (via SCKs 1415-1417), TSM transitions to the Exist1-DR state1312 and performs the last shift operation on the rising edge of TCK1418 (via SCK 1419), TSM transitions to the Update-DR state 1318 on TCK1420 then back to the Select-DR state 1306 on TCK 1408 to repeat thecapture and shift operation.

As can be seen, it takes four TCK rising edges (1420,1408,1410,1412) tocapture data following the last shift TCK rising edge 1418. This fourTCK delay in capturing data after the last shift operation has occurredprevents at-speed or delay testing of the combinational logic. At-speedand delay testing requires that a capture operation be performedimmediately after the last shift operation. Therefore faults incombinational logic on slow stimulus to response paths cannot be testedadequately using a TAP 1004 to control the SCK and SEN signals of scantest architectures. As a result, TAPs are seldom used to control scantest architectures. The following FIGS. 15 and 16 illustrate how thescan test architectures of FIGS. 10 and 11 can be altered to eliminatethe TAP capture delay described in FIGS. 12, 13, 14 and 14A above.

FIG. 15A illustrates an embodiment of the disclosure in a device 1502.The scan test architecture of FIG. 15A is the same as the scan testarchitecture of FIG. 10 with the following exception. A FF 1508 and anAnd gate 1504 have been added to the architecture. The data input to theFF 1508 is coupled to the TMS input and the clock input of FF 1508 iscoupled to the TCK input via inverter 706. The And gate 1504 has aninput coupled to the data output of FF 1508, and input coupled to acontrol signal 1506 output from TAP 1004, and an output coupled to theSEN inputs of the scan registers 104 and compare circuit 404. The SCKsignal from the TAP 1004 and the SEN signal from the And gate 1504control the scan test architecture as previously described in FIG. 10,i.e. when SEN is low, response data from combinational logic is capturedinto scan registers 104 on the rising edge of SCK and when SEN is high,the scan registers 104 shift data from SDI 1-N to SDO 1-N on the risingedge of SCK while the compare circuit 404 compares the SDO 1-N data fromthe scan registers against EDI 1-N data from FFs 704 on the rising edgeof SCK. The difference between the FIG. 10 and FIG. 15A scanarchitectures is that the SEN signal is provided by the TMS input, viaFF 1508, instead of being provided by the TAP as in FIG. 10. Also theTAP 1004 of FIG. 15A remains in the Shift-DR state 1310 during the scantest operation, instead of transitioning through the data register scanstates mentioned in FIG. 14B. During test, the control signal 1506 fromTAP 1004 is set high to allow the SEN output from FF 1508 to passthrough And gate 1504 to be input to the scan registers 104 and comparecircuit 404. The control signal 1506 can be set high by an instructionloaded into the TAP's instruction register 1206. The control signal 1506may, for example, be coupled to the ShiftDR signal 1406 from TSM 1402 ofFIG. 14A in response to the loaded instruction. While an And gate 1504is shown in FIG. 15A, other types of gating arrangements could besimilarly used to gate the SEN signal from FF 1508 on and off.

FIG. 15B illustrate the timing operation of the scan test architectureof FIG. 15A. The operation is similar to the operation of the scanarchitecture of FIG. 10 in that SDI 1-N data is input on the rising edgeTCK and EDI 1-N data is input on the falling edge of TCK. The differencein the operation of FIG. 15B is that the SEN signal that controls thecapturing of data into the scan registers 104 and the shifting of thescan registers 104 and comparing of the SDO 1-N outputs of the scanregisters 104 is provided by the TMS input, instead of by the TAP 1004.As seen, TMS signals are input on the TMS input lead on the rising edgeof TCK to control the operation of TAP 1004 and SEN signals are input onthe TMS input lead to FF 1508 on the falling edge of TCK to control thecapture and shift/compare operations.

As mentioned in FIG. 15A, the TAP 1004 remains in the Shift-DR state1310 of FIG. 13 during the scan test operation. While in the Shift-DRstate 1310, the TAP 1004 couples the free running TCK input to the SCKoutput to continuously output SCKs to the scan registers 104 and comparecircuit 404. As seen in the timing diagram, at predetermined timesduring the continuously running SCK a connected tester inputs a SENsignal 1510 on TMS to set the SEN output 1512 of And gate 1504 low,which causes the scan registers 104 to cease shifting and capture datafrom combinational logic under test. Also the low on the SEN signaldisables the compare operation of the compare circuit 404. After settingthe SEN signal low, the tester inputs a SEN signal 1514 on TMS to setthe SEN output 1512 of And gate 1504 back high to cause the scanregisters 104 to shift data and the compare circuit to compare the SDO1-N outputs of the scan registers 104 against the EDI 1-N inputs fromthe tester.

It should be understood that the tester may set the SEN signal 1512 lowfor more than one SCK to allow the scan register 104 to performback-to-back capture operations if desired.

It should also be understood that while the example of FIG. 15A andother Figures to follow describe a logic low state on SEN for captureand a logic high state on SEN for shift and compare operations, thedisclosure is not limited to a particular logic state implementation forSEN. Indeed, the disclosure may be designed according to any desiredlogical realization to where one of the logical SEN states performs thestep of capturing data and the other logical SEN state performs the stepof; (1) shifting and comparing the captured data, (2) shifting andcompressing the captured data, or (3) shifting the captured data out ofthe device.

As can be seen in the timing diagram the scan test architecture of FIG.15A allows a capture operation 1516 to occur immediately after a lastshift/compare operation 1518. This immediate capture operation at theend of a scan operation is enabled by having the tester provide the SENsignal 1512 instead of having the TAP 1004 provide the SEN signal 1512.Thus the scan test architecture of FIG. 15A overcomes the capture delayproblem mentioned in regard to the scan test architecture of FIG. 10,which advantageously enables the scan test architecture of FIG. 15A toperform at-speed and/or delay scan test operations.

FIG. 16A illustrates an embodiment of the disclosure in a device 1602.The scan test architecture of FIG. 16A is the same as the scan testarchitecture of FIG. 15 with the exception that a compressor circuit 504has been substituted for the compare circuit 404 of FIG. 15. Thecompressor circuit 504 is a multiple input shift register (MISR)circuit, which is a known type of data compression circuit. Also FFs 704input MDI 1-N data from a tester to compressor circuit 504 instead ofEDI 1-N data as in FIG. 15. The SCK signal from the TAP 1004 and the SENsignal from the And gate 1504 control the scan test architecture aspreviously described in FIG. 15. When SEN is low response data fromcombinational logic is captured into scan registers 104 on the risingedge of SCK and when SEN is high the scan registers 104 shift data fromSDI 1-N to SDO 1-N on the rising edge of SCK while the compressorcircuit 504 compresses unmasked SDO 1-N data from the scan registersinto a signature on the rising edge of SCK.

As with the difference between the FIG. 10 and FIG. 15 scan testarchitectures, the difference between the FIG. 11 and FIG. 16A scanarchitectures is that the SEN signal is provided by the TMS input, viaFF 1508, instead of being provided by the TAP as in FIG. 11. As with theTAP 1004 of FIG. 15, the TAP 1004 of FIG. 16A remains in the Shift-DRstate 1310 during the scan test operation, instead of transitioningthrough the data register scan states mentioned in FIG. 14A. Duringtest, the control signal 1506 from TAP 1004 is set high to allow the SENoutput from FF 1508 to pass through And gate 1504 to be input to thescan registers 104 and compressor circuit 504. The control signal 1506can be set high by an instruction loaded into the TAP's instructionregister 1206. While an And gate 1504 is shown in FIG. 15, other typesof gating, such as but not limited to OR, NAND, or NOR gating, could beused to gate the SEN signal on and off.

FIG. 16B illustrate the timing operation of the scan test architectureof FIG. 16A. The operation is the same as the operation described inFIG. 15B with the exception that the SEN signal 1512 controls thecompressor circuit 504 of FIG. 16A instead of the compare circuit 404 ofFIG. 15. As seen, the SEN signal 1512 that controls the capturing ofdata into the scan registers 104 and the shifting of the scan registers104 and compressing of masked and unmasked SDO 1-N outputs of the scanregisters 104 is provided by the TMS input, instead of by the TAP 1004.TMS signals are input on the TMS input on the rising edge of TCK tocontrol the operation of TAP 1004 and SEN signals are input on the TMSinput to FF 1508 on the falling edge of TCK to control the capture andshift/compress operations.

As mentioned above, the TAP 1004 remains in the Shift-DR state 1310 ofFIG. 13 during the scan test operation. While in the Shift-DR state1310, the TAP 1004 couples the free running TCK input to the SCK outputto continuously output SCKs to the scan registers 104 and compressorcircuit 504. As seen in the timing diagram, at predetermined timesduring the continuously running SCK a connected tester inputs a SENsignal 1510 on TMS to set the SEN output 1512 of And gate 1504 low,which causes the scan registers 104 to capture data and disables thecompress operation of the compressor circuit 504. After setting the SENsignal low, the tester inputs a SEN signal 1514 on TMS to set the SENoutput 1512 of And gate 1504 back high to cause the scan registers 104to shift data and the compressor circuit to compress masked and unmaskedSDO 1-N outputs of the scan registers 104 into a signature.

As can be seen in the timing diagram the scan test architecture of FIG.16A allows a capture operation 1516 to occur immediately after a lastshift/compress operation 1518. This immediate capture operation at theend of a scan operation is enabled by having the tester provide the SENsignal 1512 instead of having the TAP 1004 provide the SEN signal 1512.Thus the scan test architecture of FIG. 15 overcomes the capture delayproblem mentioned in regard to the scan test architecture of FIG. 11,which advantageously enables the scan test architecture of FIG. 16A toperform at-speed and/or delay test operations.

FIG. 17A illustrates an embodiment of the present disclosure in a device1702. The scan test architecture of device 1702 comprises a scanregister 104, a TAP 1004, a FF 704, and a circuit 1704. The scanregister has an input coupled to the devices TDI input, an input coupledto SCK from TAP 1004, an input coupled to SEN from TAP 1004, and a SDOoutput coupled to circuit 1704. Circuit 1704 has an input coupled to thescan register SDO output, an input coupled to the output of FF 704, aninput coupled to SCK, an input coupled to SEN, an input coupled to thedevices TDI input lead and an output coupled to the devices TDO outputlead. The TAP receives control from TMS and TCK device inputs. The FF704 has a data input coupled to TDI, a clock input coupled to TCK viainverter 706, and an output coupled to circuit 1704. Circuit 1704 can bea compare circuit 404 or a compressor circuit 504. If circuit 1704 is acompare circuit 404, the data output from FF 704 will EDI data to beused by the compare circuit 404 as previously described. If circuit 1704is a compressor circuit 504, the data output from FF 704 will be MDIdata to be used by the compressor circuit 504 as previously described.The XDI term used on the output of FF 704 of FIG. 17 is to indicate thatthe output can be either EDI data or MDI data. At the end of a test, thecontents of circuit 1704, compare results or signature, can be scan outof the device 1702 via the JTAG TDI to TDO scan path through circuit1704.

FIG. 17B illustrates the timing operation of the scan test architectureof FIG. 17A. The TDI input lead of device 1702 inputs TDI data to thescan register 104 on the rising edge of TCK and XDI data to FF 704 onthe falling edge of TCK. The TMS input lead inputs TMS signals to theTAP 1004 on the rising edge of TCK. If circuit 1704 is a compare circuit404, the XDI data from FF 704 will be EDI data used to compare againstthe SDO data output from scan register 104. If circuit 1704 is acompressor circuit 504, the XDI data from FF 704 will be MDI data usedto mask or unmask the SDO data output from scan register 104 aspreviously described.

FIG. 18A illustrates a device 1802 containing the scan test architectureof FIG. 17A modified to where the XDI signal to circuit 1704 is providedby the device TMS input lead via FF 704 instead of by the device TDIinput lead of FIG. 17A. As seen in the timing diagram of FIG. 18A, theoperation of the scan test architecture of FIG. 18A is identical to thatof FIG. 17A with the exception that the XDI signal is provided by theTMS input lead.

FIG. 19A illustrates an embodiment of the present disclosure in a device1902. The scan test architecture of device 1902 comprises a scanregister 104, a TAP 1004, a FF 704, a FF 1508, an And gate 1504, and acircuit 1704. The scan register has an input coupled to the devices TDIinput lead, an input coupled to SCK from TAP 1004, an input coupled tothe SEN output from And gate 1504, and a SDO output coupled to circuit1704. Circuit 1704 has an input coupled to the scan register SDO output,an input coupled to the XDI output of FF 704, an input coupled to theSCK output of TAP 1004, an input coupled to the SEN output of And gate1504, an input coupled to the devices TDI input lead and an outputcoupled to the devices TDO output lead. And gate 1504 has an inputcoupled to the SEN output of FF 1508, an input coupled to a controlsignal 1506 from TAP 1004, and an output coupled to scan register 104and circuit 1704. The TAP receives control from TMS and TCK deviceinputs. The FF 704 has a data input coupled to TDI, a clock inputcoupled to TCK via inverter 706, and an output coupled to circuit 1704.As mentioned in FIG. 17, circuit 1704 can be a compare circuit 404 or acompressor circuit 504. If circuit 1704 is a compare circuit 404, theXDI data output from FF 704 will EDI data to be used by the comparecircuit as previously described. If circuit 1704 is a compressor circuit504, the XDI data output from FF 704 will be MDI data to be used by thecompressor circuit as previously described. At the end of a test, thecontents of circuit 1704, compare results or signature, can be scan outof the device 1902 via the JTAG TDI to TDO scan path through circuit1704.

FIG. 19B illustrates the timing operation of the scan test architectureof FIG. 19A. The TDI input lead of device 1902 inputs TDI data to thescan register 104 on the rising edge of TCK and XDI data to FF 704 onthe falling edge of TCK. The TMS input lead of device 1902 inputs TMSsignals to TAP 1004 on the rising edge of TCK and SEN control signals toFF 1508 on the falling edge of TCK. If circuit 1704 is a compare circuit404, the XDI data from FF 704 will be EDI data used to compare againstthe SDO data output from scan register 104. If circuit 1704 is acompressor circuit 504, the XDI data from FF 704 will be MDI data usedto mask or unmask the SDO data output from scan register 104 aspreviously described. The SEN control signal from FF 508 is used tooperate the SEN output of And gate 1504 to control the operation of scanregister 104 and circuit 1704 as previously described in regard to FIG.15.

FIG. 20A illustrates a device 2002 containing the scan test architectureof FIG. 19A modified to where the XDI signal is provided to circuit 1704by the TMS input lead via FF 1508 and the SEN signal is provided to scanregister 104 and circuit 1704 by the TDI input lead via FF 704. As seenin the timing diagram of FIG. 20B, the operation of the scan testarchitecture of FIG. 20 is identical to that of FIG. 19 with theexception that the XDI signal is provided by the TMS input lead and theSEN signal is provided by the TDI input lead.

FIG. 21A illustrates an embodiment of the present disclosure in a device2102. The scan test architecture of device 2102 comprises a scanregister 104, a TAP 1004, a FF 704, a FF 1508 and a compare circuit2104. The scan register has an input coupled to the devices TDI inputlead, an input coupled to SCK from TAP 1004, an input coupled to SENfrom TAP 1004, and a SDO output coupled to compare circuit 2104. Comparecircuit 2104 has an input coupled to the scan register SDO output, aninput coupled to the EDI output of FF 704, an input coupled to the MDIoutput of FF 1508, an input coupled to SCK, an input coupled to SEN, aninput coupled to the devices TDI input lead and an output coupled to thedevices TDO output lead. The TAP receives control from TMS and TCKdevice inputs. The FF 704 has a data input coupled to TDI, a clock inputcoupled to TCK via inverter 706, and an EDI output coupled to comparecircuit 2104. The FF 1508 has a data input coupled to TMS, a clock inputcoupled to TCK via inverter 706, and an MDI output coupled to comparecircuit 2104. Compare circuit 2102 differs from compare circuit 404 inthat it inputs both a EDI and MDI signal. The EDI signal is used tocompare against the SDO output from scan register 104 and the MDI signalis used to mask off the result of the compare operation between the EDIand SDO signals. At the end of a test, the contents of compare circuit2104 can be scanned out of the device 2102 via the JTAG TDI to TDO scanpath through compare circuit 2104.

FIG. 21B illustrates one example implementation of compare circuit 2104.The compare circuit 2104 includes a comparing circuit 406, such as anXOR gate, that inputs an SDO signal from scan register 104 and an EDIsignal from a tester via FF 704 and outputs a comparison result signal.The compare circuit 2104 includes a masking gate 506, such as an ANDgate, that inputs the comparison result signal from comparing circuit408 and a MDI signal from a tester via FF 1508, and outputs a signal toa memory circuit 408. The memory circuit 408 operates in response to theSCK and SEN signals to evaluate the signal output from masking gate 506to determine whether a SDO to EDI comparison passes or fails during thetest. Some SDO outputs from scan register 104 may be in unknown states.It is not possible to use the EDI input to compare against SDO outputsthat are unknown. Whenever an unknown SDO signal is output from the scanregister 104, the tester will input a MDI signal, via FF 1508, to themasking gate 506 to force the output of masking gate 506 to a comparepass state, independent of the actual compare output from comparecircuit 406. The memory circuit 408 treats a forced compare pass statefrom mask gate 506 as a passing compare operation between SDI and EDI.

At the end of the test, the test comparison results of the memorycircuit 408 can be accessed via the JTAG TDI and TDO scan path signals.The compare circuit 408 can be of any complexity. For example thecompare circuit 408 can be as simple as a flip flop that latches a stateupon the first detection of a comparison failure signal or the comparecircuit 408 can be more sophisticated, perhaps including multiple faildetection memory latches and a failure logging circuit that indicateswhich compare operation(s) failed.

FIG. 21C illustrates the timing operation of the scan test architectureof FIG. 21A. The TDI input lead of device 2102 inputs TDI data to thescan register 104 on the rising edge of TCK and EDI data to FF 704 onthe falling edge of TCK. The TMS input lead inputs TMS signals to theTAP 1004 on the rising edge of TCK and MDI data to FF 1508 on thefalling edge of TCK. The tester transitions the TAP 1004 through thedata register shifting states of FIG. 13, as described in FIG. 14A, toperform the capture and shift/compare operations. The capture andshift/compare operations repeat until the test is complete. At the endof the test, the test results stored in the memory circuit 2104 can beshifted out to the tester for examination via the JTAG TDI and TDO scanpath.

FIGS. 22A and 22B are provided to illustrate that the scan testarchitecture and operation described in regard to FIGS. 21A, 21B, and21C can be modified to operate in a device 2202 whereby the TDI inputlead provides the MDI data input to compare circuit 2104, via FF 704,and the TMS input lead provides the EDI data input to compare circuit2104, via FF 1508. With the exception that EDI is provided by the TMSinput lead and MDI is provided by the TDI input lead, the scanarchitecture and operation of FIGS. 22A and 22B is the same as the scanarchitecture and operation of FIGS. 21A, 21B and 21C.

FIG. 23A illustrates an embodiment of the present disclosure in a device2302. The scan test architecture of device 2302 comprises a scanregister 104, a TAP 1004, an And gate 1504, FFs 1508 and 2304, andinverters 706 and 2306. The scan register has an input coupled to thedevices TDI input lead, an input coupled to SCK from TAP 1004, an inputcoupled to the SEN signal from And gate 1504, and a SDO output coupledto the TDO output lead, via FF 2304. According to the JTAG (1149.1)standard, the TDO output of a device is to be registered on the fallingedge of TCK. To meet this falling edge requirement, FF 2304 is placed inthe data path between scan register 104 SDO output and the device TDOoutput lead and clocked by TCK via inverter 2306. The inversion functionof inverter 2306 could be performed by inverter 706 if desired whichwould eliminate the need of inverter 2306.

It should be understood that the disclosure is not limited to requiringFF 2304 in the TDO path and it could be removed, along with inverter2306, if so desired to provide a non-registered path between the scanregister's SDO output and the device's TDO output lead.

The TAP 104 receives control from the TMS and TCK device input leads.The FF 1508 has a data input coupled to TMS, a clock input coupled toTCK via inverter 706, and a SEN output coupled to scan register 104 viaAnd gate 1504. The SEN output from And gate 1504 is used to control whenthe scan register captures and shifts data. As mentioned in regard toFIG. 15, using the SEN output of FF 1508 to control when the scanregister 104 captures and shifts data instead of using the SEN outputfrom TAP 1004 eliminates the undesired delay between a last shiftoperation and the capture operation.

During test, the TAP 1004 is transitioned into and remains in theShift-DR state 1310 of FIG. 13. Control signal 1506 is set high duringthe Shift-DR state 1310 to allow the And gate 1504 to pass the SENsignal from FF 1508 to scan register 104. As mentioned, the controlsignal 1506 could be the ShiftDR signal 1406 of FIG. 14. While the TAPis in the Shift-DR state 1310 and the SEN signal from FF 1508 is high,the scan register 104 shifts data to and from a tester via the TDI andTDO device leads. During the shifting of data, the SEN signal from FF1508 is periodically set low, via the TMS input lead, to cause the scanregister to capture response data from combinational logic under test.At the end of a test, the TAP transitions out of the Shift-DR state 1310and sets the control signal 1506 low, inhibiting And gate 1504 frompassing the SEN signal from FF 1508 to scan register 104.

FIG. 23B illustrates the timing operation of the scan test architectureof FIG. 23A. The TDI input lead of device 2302 inputs TDI data from atester to the scan register 104 on the rising edge of TCK and the TDOoutput lead of device 2302 outputs TDO data to a tester from the scanregister 104 on the falling edge of TCK. The TMS input lead inputs TMSsignals to the TAP 1004 on the rising edge of TCK and SEN controlsignals to FF 1508 on the falling edge of TCK.

FIGS. 24A and 24B are provided to illustrate that the scan testarchitecture and operation described in regard to FIGS. 23A and 23B canbe modified to operate in a device 2402 whereby the TDI input leadprovides the SEN control signal to scan register 104 via FF 1508. Withthe exception that the SEN control signal is provided by the TDI inputlead instead of by the TMS input lead, the scan architecture andoperation of FIGS. 24A and 24B is the same as the scan architecture andoperation of FIGS. 23A and 23B.

As seen, the device scan test architectures of FIGS. 17-24 only use theTDI, TMS, TCK and TDO signal leads of the JTAG (IEEE 1149.1) standard.Since the JTAG TDI, TMS, TCK and TDO signal leads are dedicated devicesignal leads, i.e. not shared with functional device signal leads as arethe SDI and SDO signals of previous Figures, these scan testarchitectures can be accessed to test the devices at any point in thedevice's life cycle. For example, a device manufacturer can access thescan test architectures to test the device during its design andmanufacture and the customer purchasing the device can access the scantest architecture to test the device in the customer's systemapplication.

FIG. 25A illustrates an embodiment of the present disclosure in a device2502. The scan test architecture of device 2502 comprises scan registers1-N 104, a TAP 1004, an And gate 1504, and inverter 706. During test thescan registers 1-N have inputs coupled to the SDI 1-N device inputleads, an input coupled to SCK from TAP 1004, an input coupled to theSEN signal from And gate 1504, and outputs coupled to the SDO 1-N deviceoutput leads. The TAP 104 receives control from the TMS and TCK deviceinput leads. The FF 1508 has a data input coupled to TMS, a clock inputcoupled to TCK via inverter 706, and a SEN output coupled to the scanregisters 1-N 104 via And gate 1504. The SEN output from And gate 1504is used to control when the scan registers 1-N capture and shift data.As mentioned in regard to FIG. 15, using the SEN output of FF 1508 tocontrol when the scan registers 1-N 104 capture and shift data insteadof using the SEN output from TAP 1004 eliminates the delay between alast shift operation and the capture operation.

During test, the TAP 1004 is transitioned into and remains in theShift-DR state 1310 of FIG. 13. Control signal 1506 is set high duringthe Shift-DR state 1310 to allow the And gate 1504 to pass the SENsignal from FF 1508 to scan registers 104. While the TAP is in theShift-DR state 1310 and the SEN signal from FF 1508 is high, the scanregisters 1-N 104 shift data to and from a tester via the SDI 1-N andSDO 1-N device leads. During the shifting of data, the SEN signal fromFF 1508 is periodically set low by the tester, via the TMS input lead,to cause the scan registers 104 to cease shifting and capture responsedata from combinational logic under test. At the end of a test, thetester transitions the TAP out of the Shift-DR state 1310 which sets thecontrol signal 1506 low, inhibiting And gate 1504 from passing furtherSEN signals from FF 1508 to scan registers 1-N 104.

FIG. 25B illustrates the timing operation of the scan test architectureof FIG. 25A. The SDI 1-N input leads of device 2502 input test stimulusdata from a tester to the scan registers 104 on the rising edge of TCKand the SDO 1-N output leads output test response data to a tester fromthe scan registers 104 on the rising edge of TCK. The TMS input leadinputs TMS signals to the TAP 1004 on the rising edge of TCK and SENcontrol signals to FF 1508 on the falling edge of TCK. During test, thetester inputs SEN control signals to cause the scan registers to shiftand capture data as previously described.

FIG. 26 illustrates an arrangement between a tester 2602 and devices2604 being scan tested in parallel. Devices 2604 could be devices 2302of FIG. 23, device 2402 of FIG. 24 or devices 2502 of FIG. 25. Thetester outputs test stimulus data to all devices 2604 via bus 2606 andoutputs TMS and TCK signals to all devices 2604 via bus 2608. The testerinputs test response data from each device 2604 using a separate bus2610-2616 from each device 2604. If the devices 2604 being tested aredevices 2302 or 2402 of FIGS. 23 and 24, tester output bus 2606 inputsTDI data to the devices while tester input buses 2610-2616 input TDOdata from the devices. If the devices 2604 being tested are devices 2502of FIG. 25, tester output bus 2606 inputs SDI 1-N data to the deviceswhile tester input buses 2610-2616 input SDO 1-N data from the devices.During test, the tester inputs the SEN control signal to the devices toregulate when the scan registers of the devices shift and capture data,as previously described in regard to FIGS. 23-25.

FIG. 27 illustrates an arrangement between a tester 2702 and devices2604 being scan tested in series. Devices 2604 could be devices 2302 ofFIG. 23, device 2402 of FIG. 24 or devices 2502 of FIG. 25. The testeroutputs test stimulus data to the first device 2604 in the seriesarrangement via bus 2704 and outputs TMS and TCK signals to all devices2604 via bus 2706. The tester inputs test response data from the lastdevice in the serial arrangement via bus 2708. The devices are connectedtogether in series via buses 2710, such that the TDO or SDO 1-N outputsof a leading device 2604 connects to the TDI or SDI 1-N inputs of atrailing device 2604, respectively. If the devices 2604 are devices 2302or 2402 of FIGS. 23 and 24, TDO to TDI connections are formed between aleading and trailing device via buses 2710. If the devices 2604 aredevices 2502 of FIG. 25, SDO 1-N to SDI 1-N connections are formedbetween a leading and trailing device via buses 2710. It should be notedthat if the devices 2604 are devices 2302 or 2402 in a customer's system2712, the devices can be scan tested using the dedicated TDI, TMS, TCKand TDO device leads. During test, the tester inputs the SEN controlsignal to the devices to regulate when the scan registers of the devicesshift and capture data, as previously described in regard to FIGS.23-25.

FIG. 28 is provided to illustrate that the disclosure's feature ofinputting the SEN control signal from a device 2802 TMS input lead onthe falling edge of TCK can be used generally to provide the previouslydescribed improved shift and capture control to any type of scan testcircuitry 2804 within the device 2802. As seen the scan test circuitry2804 can receive test input from a TDI input or from SDO 1-N inputs andcan output test results from a TDO output, SDO 1-N outputs, or from aTDI to TDO scan path. While the SEN control signal is shown beingprovided by the TMS input lead in FIG. 28, it may also be provided by aTDI or SDI input lead as well as described previously in regard to FIGS.20 and 24.

FIG. 29A illustrates that the scan test circuitry 2804 of FIG. 28 may bea decompressor and compactor type scan test circuit. The decompressor2902 operates to receive compressed input patterns from a tester via aTDI input lead, decompress the input pattern into parallel scan outputs,and input the parallel scan outputs to scan inputs of parallel scanregisters 104. The compactor 2904 operates to receive scan outputs fromthe parallel scan registers 104, compact the scan outputs into acompressed format for outputting to a tester using a TDO output lead.Using a decompressor and compactor type scan test circuits allowsaccessing a large number of parallel scan paths using a small number ofdevice inputs and outputs (TDI and TDO in this case). A variety ofdecompressor circuits based on linear feedback shift registers (LFSR) orring generators exist that could be adapted for use in the scan testarchitecture of FIG. 29A. Also a variety of compactor circuits based onXOR gating exist that could be adapted for use in the scan testarchitecture of FIG. 29A. In this embodiment, the single inputdecompressor 2902, scan registers 104, and single output compactor 2904are shown to operate in response to the SCK and SEN signals of FIG. 28.

During operation, the decompressor 2902 responds to SCK while SEN ishigh (i.e. scan register shift mode) to: (1) input compressed stimulusdata from TDI, (2) decompress the compressed stimulus data input intoparallel stimulus data output, and (3) input the parallel stimulus datato the scan registers 104. When the scan registers 104 are filled withthe parallel stimulus data from decompressor 2902, the SEN signals goeslow to cause the scan registers to capture the response outputs fromcombinational logic under test. The decompressor 2902 responds to theSEN signal going low to prepare for the next compressed stimulus datainput from TDI. For example, decompressor 2902 may be prepared for thenext compressed stimulus data input from TDI by being reset or otherwiseinitialized in response to SEN going low. Compactor 2904 consists of XORgating that compacts the scan register 104 outputs (SR Out) into asingle signal that is output on TDO.

An example XOR (X) compactor that could be used for compactor 2904 isshown in FIG. 29B. The TDO output of the FIG. 29B compactor could beregistered with a FF 2906, shown in dotted line, to provide a registeredTDO output to the tester if desired. If a registration FF 2906 is usedon TDO, the FF could be timed by the SCK signal as shown in dotted linein FIGS. 29A and 29B.

FIG. 30A illustrates that the scan test circuitry 2804 of FIG. 28 may beanother type of decompressor and compactor scan test circuit. Thedecompressor 3002 operates to receive compressed input patterns from atester via two or more SDI input leads, decompress the input patterninto parallel scan outputs, and input the parallel scan outputs to scaninputs of parallel scan registers 104. The compactor 3004 operates toreceive scan outputs from the parallel scan registers 104, compact thescan outputs into a compressed format for outputting to a tester usingtwo or more SDO output leads. As with FIG. 29A, variety of decompressorand compactor type circuits exist that could be adapted for use in thescan test architecture of FIG. 30A. In this embodiment, the multipleinput decompressor 3002, scan registers 104, and multiple outputcompactor 3004 are shown to operate in response to the SCK and SENsignals of FIG. 28.

During operation, the decompressor 3002 responds to SCK while SEN ishigh to: (1) input compressed stimulus data from the SDI inputs, (2)decompress the compressed stimulus data input into parallel stimulusdata output, and (3) input the parallel stimulus data to the scanregisters 104. When the scan registers 104 are filled with the parallelstimulus data from decompressor 3002, the SEN signals goes low to causethe scan registers to capture the response outputs from combinationallogic under test. The decompressor 3002 responds to the SEN signal goinglow to prepare for the next compressed stimulus data input from SDI 1-N.For example, decompressor 3002 may be prepared for the next compressedstimulus data input from SDI 1-N by being reset or otherwise initializedin response to SEN going low. Compactor 3004 consists of XOR gating thatcompacts the scan register 104 outputs (SR Out) into two or more signalsthat is output on SDO 1-N.

An example XOR (X) compactor that could be used for compactor 3004 isshown in FIG. 30B. The SDO outputs of the FIG. 30B compactor could beregistered with a FF 2906, shown in dotted line, to provide registeredSDO outputs to the tester if desired. If registration FFs 2906 are usedon the SDO outputs, the FFs could be timed by the SCK signal as shown indotted line in FIGS. 30A and 30B.

FIG. 31 illustrates that the scan test circuitry 2804 may comprise asingle input decompressor 2902, a compactor 3004 and a compressor 3102.The compactor 3004 is used to reduce the number of scan register outputsdown to a reasonable number for input to the compressor 3102. Ifdesired, the compactor 3004 may be removed to allow the compressor 3102to directly receive all the scan register 104 outputs, but this wouldincrease the size of the compressor circuit 3102. The decompressor 2902and compactor 3004 operates as described in FIGS. 29 and 30. Thecompressor 3102 operates to receive compacted scan outputs from theparallel scan registers 104 via compactor 3004 and compress them into asignature for outputting to a tester using a JTAG TDI and TDO scan pathor other output means. Compressor 3102 is similar to compressor 504 ofFIG. 16 in that it compresses the compacted scan register outputs fromthe compactor 3004 into a signature in response to SCK while the SENsignal is high, i.e. while the scan registers are shifting. Howevercompressor 3102 does not include the ability to mask the outputs fromscan registers 104, as did compressor 504. In this embodiment, thedecompressor 2902, scan registers 104, compactor 3004 and compressor3102 are shown to operate in response to the SCK and SEN signals of FIG.28.

During operation, the decompressor 2902 responds to SCK while SEN ishigh to: (1) input compressed stimulus data from TDI, (2) decompress thecompressed stimulus data input into parallel stimulus data output, and(3) input the parallel stimulus data to the scan registers 104. Thecompressor 3102 responds to SCK while SEN is high to: (1) inputcompacted scan outputs from compactor 3004 and (2) compress thecompacted scan outputs into a signature. When the scan registers 104 arefilled with the parallel stimulus data from decompressor 2902, the SENsignals goes low to cause the scan registers to capture the nextresponse outputs from combinational logic under test. The decompressor2902 responds to the SEN signal going low to prepare for the nextcompressed stimulus data input from SDI 1-N, as described in FIG. 29.The compressor 3102 responds to the SEN signal going low to cease itscompression operation.

FIG. 32 illustrates that the scan test circuitry 2804 may comprise amultiple input decompressor 3002, a compactor 3004 and compressor 3102.As previously described in FIG. 30, decompressor 3002 operates toreceive compressed stimulus input on two or more SDI input leads andoutputs decompressed parallel outputs to parallel scan registers 104. Aspreviously described in FIG. 31, compressor 3102 operates to receivecompacted scan outputs from scan registers 104, via compactor 3004, andcompress them into a signature for outputting to a tester using a JTAGTDI and TDO scan path or other output means. In this embodiment, thedecompressor 3002, scan registers 104, compactor 3004 and compressor3102 are shown to operate in response to the SCK and SEN signals of FIG.28.

During operation, decompressor 3002 responds to SCK while SEN is highto: (1) input compressed stimulus data from SDI 1-N, (2) decompress thecompressed stimulus data input into parallel stimulus data output, and(3) input the parallel stimulus data to the scan registers 104, whilethe compressor 3102 compresses the compacted scan outputs from compactor3004 into a signature. When the scan registers 104 are filled with theparallel stimulus data from decompressor 3002, the SEN signals goes lowto cause the scan registers to capture the response outputs fromcombinational logic under test. The decompressor 3002 responds to theSEN signal going low to prepare for the next compressed stimulus datainput from SDI 1-N, as described in FIG. 30. The compressor 3102 ceasescompressing data into a signature in response to SEN going low.

FIG. 33A illustrates that the scan test circuitry 2804 may comprise adecompressor 3302 and compactor 3304. Decompressor 3302 may be eitherthe single input (TDI) decompressor 2902 of FIG. 29 or the multipleinput (SDI 1-N) decompressor 3002 of FIG. 30. Compactor 3304 is similarto compactors 2904 and 3004 but differs in that it includes maskinginputs and circuitry to allow masking off selected don't care or unknownoutputs from scan registers 104 when they are shifting data. If notmasked, don't care or unknown data from scan registers 104 can corruptthe compacted data output to the tester and invalidate the test. In thisembodiment, the decompressor 3302, scan registers 104, and compactor3304 are shown to operate in response to the SCK and SEN signals of FIG.28 and, in addition, the mask inputs to compactor 3304 are providedusing the same device input leads (TDI or SDI 1-N) that provide thecompressed stimulus data to the decompressor 3302. Thus a device usingthis embodiment, which uses the same device input leads for inputtingcompressed data to decompressor 3302 and mask data to compactor 3304,requires fewer connections to a tester

FIG. 33B illustrates an example implementation of compactor 3304 thatuses the TDI input lead to input mask data to compactor 3304 on thefalling edge of SCK. The compactor 3304 includes compactor circuit 2904of FIG. 29B, mask circuitry 3306, mask shift register (MSR) 3308, maskupdate register (MUR) 3310, and inverter 706. MSR 3308 inputs data fromTDI, the SCK signal via inverter 706, and outputs parallel data to MUR3310, either directly or via decode circuitry 3309. MUR 3310 inputsparallel data from the parallel outputs of MSR 3308, the SCK signal, theSEN signal and outputs parallel data to mask circuit 3306. The maskcircuit 3306 inputs the mask data from MUR 3310 and the scan register104 outputs (SR Out), and outputs masked or unmasked data to compactorcircuit 2904. Compactor circuit 2904 compacts the masked or unmaskeddata inputs from the mask circuit down to one signal and outputs thatone signal on the TDO output lead.

While SEN is high, the TDI input lead inputs compressed data input (CDI)to the decompressor 3302 on the rising edge of SCK and mask data input(MDI) to MSR 3308 on the falling edge of SCK, as shown in timing example3312. When SEN goes low, the mask data shifted into MSR 3308 istransferred into MUR 3310, either directly or via decode circuit 3309,to be applied to the OR gates of mask circuitry 3306. In this example, alogic high on a Mask bit forces an OR gate output high (the mask outputstate in this example) independent of the scan register output (SR Out)to the OR gate. Thus don't care outputs from one or more scan registers104 can be mask off so as not to effect the operation of compactorcircuit 2904. In this example, while OR gates are used in maskingcircuit 3306, And gates could be used in masking circuit 3306 as well.If And gates were used, logic low Mask bits would be input to comparecircuit 3306 from MUR 3310 to force the And gate outputs low, the maskstate.

FIG. 33C illustrates an example implementation of compactor 3304 thatuses plural SDI input leads, SDI 1 and SDI 2 in this example, to inputmask data to compactor 3304 on the falling edge of SCK. The compactor3304 includes compactor circuit 3004 of FIG. 30B, mask circuitry 3306 ofFIG. 33B, mask shift register (MSR) 3314, mask update register (MUR)3310 of FIG. 33B, and inverter 706. MSR 3314 inputs data from SDI 1 andSDI 2, the SCK signal via inverter 706, and outputs parallel data to MUR3310, either directly or via decode circuitry 3309. MUR 3310 inputsparallel data from the parallel outputs of MSR 3314, the SCK signal, theSEN signal and outputs parallel data to mask circuit 3306. The maskcircuit 3306 inputs the mask data from MUR 3310 and the scan register104 outputs (SR Out), and outputs masked or unmasked data to compactorcircuit 3004. Compactor circuit 3004 compacts the masked or unmaskeddata inputs from the mask circuit down to two signals, in this example,and outputs the two signals on the SDO 1 and SDO 2 output leads.

While SEN is high, the SDI 1 and SDI 2 input leads input compressed datainput (CDI) to the decompressor 3302 on the rising edge of SCK and maskdata input (MDI) to MSR 3314 on the falling edge of SCK, as shown intiming example 3316. When SEN goes low, the mask data shifted into MSR3314 is transferred into MUR 3310, either directly or via decode circuit3309, to be applied to the OR gates of mask circuitry 3306. In thisexample, a logic high on a Mask bit forces an OR gate output high (themask output state in this example) independent of the scan registeroutput (SR Out) to the OR gate. Thus don't care outputs from one or morescan registers 104 can be mask off so as not to effect the operation ofcompactor circuit 3004. While OR gates are used in masking circuit 3306,And gates could be used in the masking circuit as described in FIG. 33B.

FIG. 33D illustrates an example implementation of MSR 3314. As seen theshift register of MSR is broken up into two sections 3318 and 3320.Section 3318 inputs mask data from SDI 1 and section 3320 inputs maskdata from SDO 2 in response to the SCK input from inverter 706. Breakingthe shift register up into two sections allows the shift register to beloaded faster since the shift time to load mask data is reduced to onlyone half the length of the overall shift register. For example, a 16 bitMSR 3314 shift register can be loaded in only 8 shift cycles. If moreSDI inputs were used, a further reduction in shift register load timecan be achieved by further dividing the shift register into separatelower length shift registers.

FIG. 34 illustrates that the scan test circuitry 2804 may comprise thedecompressor circuit 3302 and compactor circuit 3304 of FIG. 33 andcompressor circuit 3102 of FIGS. 31 and 32. The scan test circuit 2804of FIG. 34 is similar to the scan test circuits 2804 of FIGS. 31 and 32with the exception that the scan test circuit of FIG. 34 uses themaskable compactor circuit 3304 of FIG. 33C instead of the non-maskablecompactor circuit 3004 of FIGS. 31 and 32. Use of compactor 3304 allowsthe compacted scan register inputs to compressor 3102 to be masked offto avoid inputting don't care inputs to compressor 3102, which wouldcorrupt the signature taken by the compressor circuit 3102. In thisembodiment, the decompressor 3302, scan registers 104, compactor 3304and compressor 3102 are shown to operate in response to the SCK and SENsignals of FIG. 28 and, in addition, the mask inputs to compactor 3304are provided using the same device input leads (TDI or SDI 1-N) thatprovide the compressed stimulus data to the decompressor 3302. Thus adevice using this embodiment, which uses the same input device leads forinputting compressed data and mask data, requires fewer connections to atester

FIG. 35A illustrates that the scan test circuitry 2804 may comprise thedecompressor circuit 3002 and compactor circuit 3004 of FIG. 30, maskgates 3502 and 3504, mask flip flops (FF) 3506 and 3508, and inverter706 connected as shown. The scan test circuit 2804 of FIG. 35A issimilar to the scan test circuit 2804 of FIG. 30 with the exception thatthe scan test circuit of FIG. 35A uses the mask gates and FFs toindividually mask the SDO 1-2 device outputs. The masking approach ofFIG. 35A differs from the masking approach of FIGS. 33A and 33B in thatthe outputs of the compactor 3004 are masked in FIG. 35A instead of theinputs to the compactor 3004 as shown in FIG. 33C.

In this embodiment, the decompressor 3002, scan registers 104, compactor3004, mask gates 3502-3504, and mask FFs 3506-3508 operate in responseto the SCK and SEN signals of FIG. 28 and, in addition, the mask datainputs (MDI) to FFs 3506-3508 are provided using the SDI 1-2 input leadsthat provide the compressed data inputs (CDI) to the decompressor 3002.Thus a device using this embodiment, which uses the SDI input leads forinputting compressed data and mask data, requires fewer connections to atester.

As seen in the timing example of FIG. 35B, and while SEN is high (shiftmode), CDI data from SDI 1 and SDI 2 is input to decompressor 3002 onthe rising edge of SCK and MDI data from SDI 1 and SDI 2 is input to themask FFs 3506-3508 on the falling edge of SCK, via inverter 706. TheMask 1 and Mask 2 outputs of FFs 3506 and 3508 are input to gates 3502and 3504, respectively, to either mask or unmask one or both of the SDO1 and SDO 2 outputs.

The advantage provided by the masking technique of FIG. 35A as opposedto the masking technique of FIG. 33C is that it allows the SDO outputsto be masked or unmasked during every SCK period of a shift operation,whereas the masking technique of FIG. 33C can only mask or unmask dataonce per shift operation. As seen in FIG. 33C, MUR 3310 is updated withnew mask data during the capture operation when SEN is low and this maskdata remains in effect during the subsequent shift operation when SEN ishigh. While only two SDIs and two SDOs are shown in this example, anynumber of SDIs and SDOs could be used. There should be an SDI input foreach SDO output to allow an SDI input to provide mask data to a FF andgate circuit combination associated with an SDO output, for example gateand FF combination 3502 and 3506 for SDO 1.

FIG. 36 illustrates that the scan test circuitry 2804 may comprise thedecompressor circuit 3002, compactor circuit 3004 and compressor circuit3102 of FIG. 32, mask gates 3502 and 3504, mask flip flops (FF) 3506 and3508, and inverter 706 connected as shown. The scan test circuit 2804 ofFIG. 36 is similar to the scan test circuit 2804 of FIG. 34 with theexception that the scan test circuit of FIG. 36 uses the mask gates andFFs to individually mask the compacted scan register outputs tocompressor 3102. The masking approach of FIG. 36 differs from themasking approach of FIG. 34 in that the outputs of the compactor 3004are masked in FIG. 36 instead of the inputs to the compactor 3304 asshown in FIG. 33C.

In this embodiment, the decompressor 3002, scan registers 104, compactor3004, mask gates 3502-3504, mask FFs 3506-3508 and compressor 3102operate in response to the SCK and SEN signals of FIG. 28 and, inaddition, the mask data inputs (MDI) to FFs 3506-3508 are provided usingthe SDI 1-2 input leads that provide the compressed data inputs (CDI) tothe decompressor 3002. Thus a device using this embodiment, which usesthe SDI input leads for inputting compressed data and mask data,requires fewer connections to a tester.

As described in regard to the timing example of FIG. 35B, and while SENis high (shift mode), CDI data from SDI 1 and SDI 2 is input todecompressor 3002 on the rising edge of SCK and MDI data from SDI 1 andSDI 2 is input to the mask FFs 3506-3508 on the falling edge of SCK, viainverter 706. The Mask 1 and Mask 2 outputs of FFs 3506 and 3508 areinput to gates 3502 and 3504, respectively, to either mask or unmask oneor both of the compacted scan register outputs to compressor 3102.

The advantage provided by the masking technique of FIG. 36 as opposed tothe masking technique of FIG. 33C is that it allows the compacted scanregister outputs to be masked or unmasked during every SCK period of ashift operation, whereas the masking technique of FIG. 33C can only maskor unmask the compacted scan register outputs once per shift operation.As seen in FIG. 33C, MUR 3310 is updated with new mask data during thecapture operation when SEN is low and this mask data remains in effectduring the subsequent shift operation when SEN is high. While only twoSDIs are used to mask or unmask two compacted scan register outputs inthis example, any number of SDIs and compacted scan register outputscould be used. There should be an SDI for each compacted scan registeroutput to allow an SDI to provide mask data to a FF and gate circuitcombination associated with a compacted scan register output.

FIG. 37B is provided to illustrate that scan test circuits 2804 shownand described in regard to FIGS. 29, 30, 31, 32, 33, 34, 35 and 36 couldbe controlled via the SCK and SEN signal outputs from a TAP 1004 beingconventionally controlled by a devices TMS and TCK input leads, insteadof by the SCK and SEN signals of FIG. 28.

FIG. 37C is provided to illustrate that scan test circuits 2804 shownand described in regard to FIGS. 29, 30, 31, 32, 33, 34, 35 and 36 couldbe controlled via a devices SCK and SEN input leads, instead of the SCKand SEN signals of FIG. 28.

As described above in regard to FIGS. 33A, 33B and 33C, MUR circuit 3310is updated with new mask data when the SEN signal goes low. SEN goes lowat the end of a shift operation to cause scan registers 104 to captureresponse data from combinational logic. Thus the MUR circuit 3310 canonly update new mask data to the mask circuit 3306 once per scan cycle,where the scan cycle is defined by a shift operation and captureoperation. It would be advantageous to be able to update the MUR 3310mask outputs multiple times during the shift operation of the scan cycleas this would allow masking of don't care bits and unmasking of carebits to occur multiple times during the shift operation. The followingdescription provides a way to allow the MUR 3310 to be updated multipletimes with new mask data during shift operations.

FIG. 38A illustrates an example implementation of a maskable compactorcircuit 3802 that allows mask data to be output from MUR 3310 multipletimes during the above mentioned shift operation. Compactor circuit 3802is similar to compactor circuit 3304 of FIG. 33B in that it comprises aMSR circuit 3308, MUR circuit 3310, mask circuit 3306, and compactorcircuit 2904. The difference between the compactor circuit 3802 of FIG.38A and the compactor circuit 3304 of FIG. 33B is that the MUR circuit3310 is clocked by the falling edge of SCK, via inverter 706, instead ofthe rising SCK edge, and the update control input to MUR circuit 3310 isprovide by the TMS signal instead of by the SEN signal of FIG. 33A.

FIG. 38A assumes the TMS signal can be used to input the update controlsignal on the falling edge of SCK, i.e. TMS provides conventional TAPcontrol input on the rising edge of TCK and update control input to MUR3310 on the falling edge of TCK, via SCK. FIG. 37B illustrates a devicewith a TMS signal that inputs TAP control on the rising edge of TCK.Since FIG. 37B does not have a purpose for TMS on the falling edge ofTCK, the TMS signal of FIG. 37B can be used to input the update controlsignal on the falling edge of TCK, which is the same signal as SCKduring shift and capture operations.

As seen in the timing diagram of FIG. 38B, the TDI signal providescompressed data input (CDI) to a decompressor, such as decompressor 3302of FIG. 33, on the rising edge of SCK and mask data input (MDI) to theMSR 3308 on the falling edge of SCK. Also as seen in FIG. 38B, the TMSsignal provides TMS input to a TAP 1004 on the rising edge of SCK andeither a no-operation (NOP) or a mask data update (MDU) signal to theMUR 3310 on the falling edge of SCK, via inverter 706. MUR 3310 updateson the falling edge of SCK when a MDU signal is input on TMS. MUR 3310does not update on the falling edge of SCK when a NOP signal is input onTMS.

As seen in timing diagram of FIG. 38C, and during shift operation 3804,MDI data is input to the MSR 3308 from TDI to load a first mask pattern(Mask-1) while NOP signals are input to MUR 3310 from TMS. When theMask-1 pattern is loaded, a MDU signal is input to MUR 3310 from TMS tocause MUR 3310 to update the Mask-1 pattern from MSR 3308 and output theMask-1 pattern to mask circuit 3306. Similarly Mask-2 through Mask-Npatterns are input to MSR 3308 and updated into MUR 3310 during theshift operation 3804. Thus maskable compactor circuit 3802 allowsmultiple mask patterns to be shifted in and updated to mask circuit 3306during shift operation 3804. At the end of the shift operation 3804 aresponse data capture (RDC) operation 3806 occurs to load the scanregisters 104 with new response data from combinational logic. MDI inputto MSR 3308 from TDI may continue during the RDC operation 3806 asindicated by dotted line box 3810. NOP or MDU signal input to MUR 3310from TMS may continue during the RDC operation 3806 as indicated bydotted line box 3812.

FIGS. 39A and 39B are provided to illustrate a maskable compactorcircuit 3902 where the TMS signal is used to input MDI data to MSR 3308on the falling edge of SCK and the TDI signal is used to input the NOPor MDU signal to MUR 3310 on the falling edge of SCK. With the exceptionthat the TMS signal is used to input the MDI data and the TDI signal isused to input the NOP or MDU signals, the operation of the maskablecompactor circuit 3902 is the same as the maskable compactor circuit3802 of FIG. 38.

FIG. 40A illustrates an example implementation of a maskable compactorcircuit 4002 that allows mask data to be output from MUR 3310 multipletimes during shift operations. Compactor circuit 4002 is similar tocompactor circuit 3304 of FIG. 33C in that it comprises a MSR circuit3314, MUR circuit 3310, mask circuit 3306, and compactor circuit 3004.The difference between the compactor circuit 4002 of FIG. 40A and thecompactor circuit 3304 of FIG. 33C is that the MUR circuit 3310 isclocked by the falling edge of SCK, via inverter 706, instead of therising SCK edge, and the NOP and MDU signals, mentioned in regard toFIG. 38, to MUR 3310 are input to MUR 3310 on the falling edge of SCKvia the SEN signal.

As seen in the timing diagram of FIG. 40B, the SDI 1 and SDI 2 signalsprovide compressed data input (CDI) to a decompressor, such asdecompressor 3302 of FIG. 33A, on the rising edge of SCK and mask datainput (MDI) to the MSR 3314 on the falling edge of SCK. Also as seen inFIG. 40B, the SEN signal provides the scan register shift or captureoperation signal on the rising edge of SCK and either a NOP or MDUsignal to the MUR 3310 on the falling edge of SCK. MUR 3310 updates onthe falling edge of SCK when a MDU signal is input on the SEN signal.MUR 3310 does not update on the falling edge of SCK when a NOP signal isinput on the SEN signal.

The scan cycle timing is the same as that shown in FIG. 38C with theexception the SDO 1 and SDO 2 signals are used to input MDI data to MSR3314 and the SEN signal is used to input the NOP or MDU signal to MUR3310. As seen in timing diagram of FIG. 38C, and during shift operation3804, MDI data is input to the MSR 3314 from SDI 1 and 2 to load a firstmask pattern (Mask-1) while NOP signals are input to MUR 3310 from theSEN signal. When the Mask-1 pattern is loaded, a MDU signal is input toMUR 3310 from the SEN signal to cause MUR 3310 to update the Mask-1pattern from MSR 3314 and output the Mask-1 pattern to mask circuit3306. Similarly Mask-2 through Mask-N patterns are input to MSR 3314 andupdated into MUR 3310 during the shift operation 3804. Thus maskablecompactor circuit 4002 allows multiple mask patterns to be shifted inand updated to mask circuit 3306 during shift operation 3804. At the endof the shift operation 3804 a response data capture (RDC) operation 3806occurs to load the scan registers 104 with new response data fromcombinational logic. The MDI to MSR 3314 and the NOP or MDU signal inputto MUR 3310 may continue during the RDC operation 3806, as indicated bydotted line boxes 3810 and 3812. The advantage of maskable compactorcircuit 4002 over the maskable compactor circuits 3802 and 3902 is thatmask data can be loaded into MSR 3314 faster since multiple inputs (SDI1-2) are use to input mask data to MSR 3314, as described previously inregard to FIGS. 33C and 33D.

FIGS. 41A and 41B are provided to illustrate that another signal, anauxiliary (AUX) signal in this example, may be used to input the NOP orMDU signals to MUR 3310 instead of using the SEN signal of FIG. 40A. TheAUX signal would provide the NOP and MDU signal to MUR 3310 on thefalling edge of SCK as did the SEN signal of FIG. 40A. Use of anothersignal, such as AUX, may be required if the SEN signal for some reasoncannot be used for inputting capture and shift control on the rising SCKand NOP or MDU control on the falling edge of SCK.

It should be understood that while this disclosure has described therising edge of TCK or SCK as the edge for inputting conventional testsignals such as TDI, SDO, and TMS, and the falling edge of the TCK orSCK for inputting additional test signals such as EDI, MDI, and SEN, itis not limited to this rising and falling clock edge operation. Indeedthe disclosure can be practiced whereby the rising clock edge inputs theadditional test signals and the falling clock edge inputs theconventional test signals if so desired.

Although the disclosure has been described in detail, it should beunderstood that various changes, substitutions and alterations may bemade without departing from the spirit and scope of the disclosure asdefined by the appended claims.

Aspects:

A device comprising a first scan data input lead, at least a second scandata input lead, a scan clock input lead, a scan enable input lead, afirst scan register having a scan input coupled to the first scan datainput lead, a clock input coupled to the scan clock input lead, acontrol input coupled to the scan enable input lead, and a scan output,at least a second scan register having a scan input coupled to thesecond scan data input lead, a clock input coupled to the scan clockinput lead, a control input coupled to the scan enable input lead, and ascan output, a first flip flop having a data input coupled to the firstscan data input lead, a clock input coupled to the scan clock input leadvia an inverter, and a data output, at least a second flip flop having adata input coupled to the second scan data input lead, a clock inputcoupled to the scan clock input lead via an inverter, and a data output,and a compressor circuit having a data input coupled to the scan outputof the first scan register, a data input coupled to the data output ofthe first flip flop, a data input coupled to the scan output of thesecond scan register, and a data input coupled to the data output of thesecond flip flop.

A test system for testing devices in parallel comprising a tester havinga scan clock output, a scan enable output, and an output bus foroutputting test signals, and a group of devices each having a scan clockinput coupled to the scan clock output, a scan enable input coupled tothe scan enable output, and an input bus coupled to the output bus forinputting a first group of test signals from the tester on the risingedge of the scan clock input and inputting a second group of testsignals from the tester on the falling edge of the scan clock input.

A device comprising a first scan data input lead, at least a second scandata input lead, a test clock input lead, a test mode select input lead,a Test Access Port having a clock input coupled to the test clock inputlead, a mode input coupled to the test mode select input lead, a scanclock output, and a scan enable output, a first scan register having ascan input coupled to the first scan data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output, at least a second scan register havinga scan input coupled to the second scan data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output, a first flip flop having a data inputcoupled to the first scan data input lead, a clock input coupled to oneof the test clock input lead and scan clock output via an inverter, anda data output, at least a second flip flop having a data input coupledto the second scan data input lead, a clock input coupled to the scanclock input lead via an inverter, and a data output, and a comparecircuit having a data input coupled to the scan output of the first scanregister, a data input coupled to the data output of the first flipflop, a data input coupled to the scan output of the second scanregister, and a data input coupled to the data output of the second flipflop.

A device comprising a first scan data input lead, at least a second scandata input lead, a test clock input lead, a test mode select input lead,a Test Access Port having a clock input coupled to the test clock inputlead, a mode input coupled to the test mode select input lead, a scanclock output, and a scan enable output, a first scan register having ascan input coupled to the first scan data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output, at least a second scan register havinga scan input coupled to the second scan data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output, a first flip flop having a data inputcoupled to the first scan data input lead, a clock input coupled to oneof the test clock input lead and scan clock output via an inverter, anda data output, at least a second flip flop having a data input coupledto the second scan data input lead, a clock input coupled to the scanclock input lead via an inverter, and a data output, and a compressorcircuit having a data input coupled to the scan output of the first scanregister, a data input coupled to the data output of the first flipflop, a data input coupled to the scan output of the second scanregister, and a data input coupled to the data output of the second flipflop.

A device comprising a first scan data input lead, at least a second scandata input lead, a test clock input lead, a test mode select input lead,a Test Access Port having a clock input coupled to the test clock inputlead, a mode input coupled to the test mode select input lead, a scanclock output, and a control output, a first flip flop having a datainput coupled to the test mode select input lead, a clock input coupledto one of the test clock input lead and scan clock output via aninverter, and a data output, a gate having an input coupled to thecontrol output of the test access port, an input coupled to the dataoutput of the first flip flop, and a scan enable output, a first scanregister having a scan input coupled to the first scan data input lead,a clock input coupled to the scan clock output, a control input coupledto the scan enable output, and a scan output, at least a second scanregister having a scan input coupled to the second scan data input lead,a clock input coupled to the scan clock output, a control input coupledto the scan enable output, and a scan output, a second flip flop havinga data input coupled to the first scan data input lead, a clock inputcoupled to one of the test clock input lead and scan clock output via aninverter, and a data output, at least a third flip flop having a datainput coupled to the second scan data input lead, a clock input coupledto the scan clock input lead via an inverter, and a data output, and acompare circuit having a data input coupled to the scan output of thefirst scan register, a data input coupled to the data output of thesecond flip flop, a data input coupled to the scan output of the secondscan register, and a data input coupled to the data output of the thirdflip flop.

A device comprising a test clock input lead, a test mode select inputlead, a Test Access Port having a clock input coupled to the test clockinput lead, a mode input coupled to the test mode select input lead, anda control output, a flip flop having a data input coupled to the testmode select input lead, a clock input coupled to the test clock inputlead via an inverter, and a data output, and a gate having an inputcoupled to the control output of the test access port, an input coupledto the data output of the flip flop, and a scan enable output.

A device comprising a first scan data input lead, at least a second scandata input lead, a test clock input lead, a test mode select input lead,a Test Access Port having a clock input coupled to the test clock inputlead, a mode input coupled to the test mode select input lead, a scanclock output, and a control output, a first flip flop having a datainput coupled to the test mode select input lead, a clock input coupledto one of the test clock input lead and scan clock output via aninverter, and a data output, a gate having an input coupled to thecontrol output of the test access port, an input coupled to the dataoutput of the first flip flop, and a scan enable output, a first scanregister having a scan input coupled to the first scan data input lead,a clock input coupled to the scan clock output, a control input coupledto the scan enable output, and a scan output, at least a second scanregister having a scan input coupled to the second scan data input lead,a clock input coupled to the scan clock output, a control input coupledto the scan enable output, and a scan output, a second flip flop havinga data input coupled to the first scan data input lead, a clock inputcoupled to one of the test clock input lead and scan clock output via aninverter, and a data output, at least a third flip flop having a datainput coupled to the second scan data input lead, a clock input coupledto the scan clock input lead via an inverter, and a data output, and acompressor circuit having a data input coupled to the scan output of thefirst scan register, a data input coupled to the data output of thesecond flip flop, a data input coupled to the scan output of the secondscan register, and a data input coupled to the data output of the thirdflip flop.

A device comprising a test data input lead, a test clock input lead, atest mode select input lead, a Test Access Port having a clock inputcoupled to the test clock input lead, a mode input coupled to the testmode select input lead, a scan clock output, and a scan enable output, aflip flop having a data input coupled to the test data input lead, aclock input coupled to one of the test clock input lead and scan clockoutput via an inverter, and a data output, a scan register having a scaninput coupled to the test data input lead, a clock input coupled to thescan clock output, a control input coupled to the scan enable output,and a scan output, and one of a compare circuit and compressor circuithaving a data input coupled to the scan output of the scan register anda data input coupled to the data output of the flip flop.

A device comprising a test data input lead, a test clock input lead, atest mode select input lead, a Test Access Port having a clock inputcoupled to the test clock input lead, a mode input coupled to the testmode select input lead, a scan clock output, and a scan enable output, aflip flop having a data input coupled to the test mode select inputlead, a clock input coupled to one of the test clock input lead and scanclock output via an inverter, and a data output, a scan register havinga scan input coupled to the test data input lead, a clock input coupledto the scan clock output, a control input coupled to the scan enableoutput, and a scan output, and one of a compare circuit and compressorcircuit having a data input coupled to the scan output of the scanregister and a data input coupled to the data output of the flip flop.

A device comprising a test data input lead, a test clock input lead, atest mode select input lead, a Test Access Port having a clock inputcoupled to the test clock input lead, a mode input coupled to the testmode select input lead, a scan clock output, and a control output, afirst flip flop having a data input coupled to the test mode selectinput lead, a clock input coupled to one of the test clock input leadand scan clock output via an inverter, and a data output, a second flipflop having a data input coupled to the test data input lead, a clockinput coupled to one of the test clock input lead and scan clock outputvia an inverter, and a data output, a gate having an input coupled tothe control output of the test access port, an input coupled to the dataoutput of the first flip flop, and a scan enable output, a scan registerhaving a scan input coupled to the test data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output, and one of a compare circuit andcompressor circuit having a data input coupled to the scan output of thescan register and a data input coupled to the data output of the secondflip flop.

a device comprising a test data input lead, a test clock input lead, atest mode select input lead, a Test Access Port having a clock inputcoupled to the test clock input lead, a mode input coupled to the testmode select input lead, a scan clock output, and a control output, afirst flip flop having a data input coupled to the test mode selectinput lead, a clock input coupled to one of the test clock input leadand scan clock output via an inverter, and a data output, a second flipflop having a data input coupled to the test data input lead, a clockinput coupled to one of the test clock input lead and scan clock outputvia an inverter, and a data output, a gate having an input coupled tothe control output of the test access port, an input coupled to the dataoutput of the second flip flop, and a scan enable output, a scanregister having a scan input coupled to the test data input lead, aclock input coupled to the scan clock output, a control input coupled tothe scan enable output, and a scan output and one of a compare circuitand compressor circuit having a data input coupled to the scan output ofthe scan register and a data input coupled to the data output of thefirst flip flop.

A device comprising a test data input lead, a test clock input lead, atest mode select input lead, a Test Access Port having a clock inputcoupled to the test clock input lead, a mode input coupled to the testmode select input lead, a scan clock output, and a scan enable output, afirst flip flop having a data input coupled to the test mode selectinput lead, a clock input coupled to one of the test clock input leadand scan clock output via an inverter, and a data output, a second flipflop having a data input coupled to the test data input lead, a clockinput coupled to one of the test clock input lead and scan clock outputvia an inverter, and a data output, a scan register having a scan inputcoupled to the test data input lead, a clock input coupled to the scanclock output, a control input coupled to the scan enable output, and ascan output and a maskable compare circuit having a data input coupledto the scan output of the scan register, a data input coupled to thedata output of the first flip flop, and a data input coupled to the dataoutput of the second flip flop.

A device comprising a test data input lead a test clock input lead, atest mode select input lead, a test data output lead, a Test Access Porthaving a clock input coupled to the test clock input lead, a mode inputcoupled to the test mode select input lead, a scan clock output, and acontrol output, a flip flop having a data input coupled to one of thetest mode select input lead and test data input lead, a clock inputcoupled to one of the test clock input lead and scan clock output via aninverter, and a data output, a gate having an input coupled to thecontrol output of the test access port, an input coupled to the dataoutput of the flip flop, and a scan enable output and a scan registerhaving a scan input coupled to the test data input lead, a clock inputcoupled to the scan clock output, a control input coupled to the scanenable output, and a scan output coupled to the test data output lead.

A device comprising a first scan data input lead, a second scan datainput lead, a test clock input lead, a test mode select input lead, afirst scan data output lead, a second scan data output lead, a TestAccess Port having a clock input coupled to the test clock input lead, amode input coupled to the test mode select input lead, a scan clockoutput, and a control output, a flip flop having a data input coupled tothe test mode select input lead, a clock input coupled to one of thetest clock input lead and scan clock output via an inverter, and a dataoutput, a gate having an input coupled to the control output of the testaccess port, an input coupled to the data output of the flip flop, and ascan enable output, a first scan register having a scan input coupled tothe first scan data input lead, a clock input coupled to the scan clockoutput, a control input coupled to the scan enable output, and a scanoutput coupled to the first scan data output lead and a second scanregister having a scan input coupled to the second scan data input lead,a clock input coupled to the scan clock output, a control input coupledto the scan enable output, and a scan output coupled to the second scandata output lead.

A device comprising a test clock input lead, a test mode select inputlead, scan test circuitry having a scan clock input and a scan enableinput, a Test Access Port having a clock input coupled to the test clockinput lead, a mode input coupled to the test mode select input lead, ascan clock output coupled to the scan clock input of the scan testcircuitry, and a control output, a flip flop having a data input coupledto the test mode select input lead, a clock input coupled to one of thetest clock input lead and scan clock output via an inverter, and a dataoutput and a gate having an input coupled to the control output of thetest access port, an input coupled to the data output of the flip flop,and a scan enable output coupled to the scan enable input of the scantest circuitry.

The scan test circuitry the preceding paragraph including a decompressorcircuit having one or more inputs coupled to one or more compressedstimulus data input leads of the device and outputs for transmittingdecompressed stimulus data to the scan inputs of plural scan registers.

The scan test circuitry of the preceding paragraph including a compactorcircuit having inputs for receiving response data outputs from pluralscan registers and one or more outputs for outputting compacted responsedata on one or more output leads of the device.

The scan test circuitry of the preceding paragraph including a compactorcircuit having inputs for receiving response data outputs from pluralscan registers and outputting compacted response data to a compressorcircuit on the device.

The scan test circuitry of the preceding paragraph including a maskablecompactor circuit having inputs for receiving response data outputs fromplural scan registers and one or more outputs for outputting compactedresponse data on one or more output leads of the device.

The scan test circuitry of the preceding paragraph including a maskablecompactor circuit having inputs for receiving response data outputs fromplural scan registers and one or more outputs for outputting compactedresponse data to a compressor circuit on the device.

The scan test circuitry of the preceding paragraph including a compactorcircuit having inputs for receiving response data outputs from pluralscan registers and one or more outputs for outputting compacted responsedata to corresponding one or more output leads of the device via one ormore corresponding mask circuits on the device.

The scan test circuitry of the preceding paragraph including a compactorcircuit having inputs for receiving response data outputs from pluralscan registers and one or more outputs for outputting compacted responsedata to a compressor circuit on the device via one or more correspondingmask circuits on the device.

A scan test architecture on a device comprising test input leads, testoutput leads, a test clock input lead, a decompressor circuit havinginputs coupled to the test input leads for inputting compressed stimulusdata from the test input leads on the rising edge of the test clockinput lead, and outputs coupled to the scan inputs of plural scanregisters for inputting decompressed stimulus data to the scanregisters, a maskable compactor circuit having inputs coupled to thescan outputs of plural scan registers for inputting test response fromthe plural scan registers, one or more inputs coupled to one or moretest input leads for inputting mask data from the one or more test inputleads on the falling edge of the test clock input lead, and outputscoupled to the test output leads for outputting compacted test responsedata.

A scan test architecture on a device comprising test input leads, a testclock input lead, a decompressor circuit having inputs coupled to thetest input leads for inputting compressed stimulus data from the testinput leads on the rising edge of the test clock input lead, and outputscoupled to the scan inputs of plural scan registers for inputtingdecompressed stimulus data to the scan registers, a maskable compactorcircuit having inputs coupled to the scan outputs of the plural scanregisters for inputting test response from the scan registers, one ormore inputs coupled to one or more test input leads for inputting maskdata from the one or more test input leads on the falling edge of thetest clock input lead, and outputs for outputting compacted testresponse data, and a compressor circuit having inputs coupled to theoutputs of the maskable compactor circuit and a clock input coupled tothe test clock input lead.

A scan test architecture on a device comprising, test input leads, testoutput leads a test clock input lead, a decompressor circuit havinginputs coupled to the test input leads for inputting compressed stimulusdata from the test input leads on the rising edge of the test clockinput lead, and outputs coupled to the scan inputs of plural scanregisters for inputting decompressed stimulus data to the scanregisters, a compactor circuit having inputs coupled to the scan outputsof the plural scan registers for inputting test response from the scanregisters, and outputs for outputting compacted response data, a maskflip flop for each compacted response data output from the compactorcircuit, each said mask flip flop having an input coupled to one of saidtest input leads, a clock input coupled to the test clock input lead viaan inverter, and a mask output, and a mask gate for each compactedresponse data output from the compactor circuit, each said mask gatehaving an input coupled to a compacted response data output from thecompactor circuit, an input coupled to a mask output from a mask flipflop, and an output coupled to a test output leads.

A scan test architecture on a device comprising test input leads, testoutput leads a test clock input lead, a decompressor circuit havinginputs coupled to the test input leads for inputting compressed stimulusdata from the test input leads on the rising edge of the test clockinput lead, and outputs coupled to the scan inputs of plural scanregisters for inputting decompressed stimulus data to the scanregisters, a compactor circuit having inputs coupled to the scan outputsof the plural scan registers for inputting test response from the scanregisters, and outputs for outputting compacted response data, a maskflip flop for each compacted response data output from the compactorcircuit, each said mask flip flop having an input coupled to one of saidtest input leads, a clock input coupled to the test clock input lead viaan inverter, and a mask output, and a mask gate for each compactedresponse data output from the compactor circuit, each said mask gatehaving an input coupled to a compacted response data output from thecompactor circuit, an input coupled to a mask output from a mask flipflop, and an output, and a compressor circuit having inputs coupled tothe outputs of the mask gates and a clock input coupled to the testclock input lead.

A maskable compactor circuit on a device comprising a mask shiftregister having a mask data input coupled to one of a test data inputlead and test mode select input lead, a clock input coupled to a testclock input lead via an inverter, and mask data outputs, a mask updateregister having an update control input coupled to one of the test datainput lead and test mode select input lead, a clock input coupled to thetest clock input lead via an inverter, and mask data outputs, a maskingcircuit having scan data inputs coupled to the scan outputs of pluralscan registers on the device, mask data inputs coupled to the mask dataoutputs from the mask update register, and data outputs, and a compactorcircuit having data inputs coupled to the data outputs of the maskingcircuit and a compacted data output coupled to a test data output lead.

A maskable compactor circuit on a device comprising a mask shiftregister having mask data inputs coupled to scan data input leads, aclock input coupled to a scan clock input lead via an inverter, and maskdata outputs, a mask update register having an update control inputcoupled to one of a scan enable input lead and auxiliary input lead, aclock input coupled to the scan clock input lead via an inverter, andmask data outputs, a masking circuit having scan data inputs coupled tothe scan outputs of plural scan registers on the device, mask datainputs coupled to the mask data outputs from the mask update register,and data outputs, and a compactor circuit having data inputs coupled tothe data outputs of the masking circuit and compacted data outputscoupled to scan data output leads.

What is claimed is:
 1. A device comprising: A. a scan data input; B. atest clock input; C. a test mode select input; D. test access portcircuitry having an input coupled to the test clock input, an inputcoupled to the test mode select input, a scan clock output, and acontrol output; E. a scan register having an input coupled to the scandata input, an input coupled to the scan clock output, a gated scanenable input, and a scan output; F. an inverter having an input coupledto the test clock input and an inverted test clock output; G. a flipflop having an input coupled to the test mode select input, an inputcoupled to the inverted test clock output, and a data output; H. gatecircuitry having an input coupled to the data output of the flip flop,an input coupled to the control output, and a gated scan enable outputcoupled to the gated scan enable input; and I. compare circuitry havinga first input coupled to the scan output of the scan register.
 2. Thedevice of claim 1 including combinational logic having parallel stimulusinputs and parallel response outputs and in which the scan registerincludes parallel stimulus outputs coupled to the parallel stimulusinputs and parallel response inputs coupled to the parallel responseoutputs.
 3. The device of claim 1 in which the compare circuitryincludes an input coupled to the scan clock output and an input coupledto the gated scan enable output.
 4. The device of claim 1 in which thecompare circuitry includes a serial test data input and a serial testdata output separate from the scan data input and the first input. 5.The device of claim 1 in which the test access port circuitry includes astate machine operating in a Test Logic Reset state, a Run Test/Idlestate, Capture states, Shift states, Exit1 states, Pause states, Exit2states, and Update states.
 6. The device of claim 1 in which the gatecircuitry is an AND gate.
 7. An integrated circuit scan testarchitecture comprising: A. combinational logic having parallel stimulusinputs and parallel response outputs; B. a scan data input, a test clockinput, and a test mode select input; C. test access port circuitryhaving a state machine operating in states, an input coupled to the testclock input, an input coupled to the test mode select input, a scanclock output, and a control output; D. a scan register having an inputcoupled to the scan data input, an input coupled to the scan clockoutput, parallel stimulus outputs coupled to the parallel stimulusinputs, parallel response inputs coupled to the parallel responseoutputs, a gated scan enable input, and a scan output; E. an inverterhaving an input coupled to the test clock input and an inverted testclock output; F. a flip flop having an input coupled to the test modeselect input, an input coupled to the inverted test clock output, and adata output; G. gate circuitry having an input coupled to the dataoutput of the flip flop, an input coupled to the control output, and agated scan enable output coupled to the gated scan enable input; and H.compare circuitry having a first input coupled to the scan output of thescan register.
 8. The architecture of claim 7 in which the comparecircuitry includes an input coupled to the scan clock output and aninput coupled to the gated scan enable output.
 9. The architecture ofclaim 7 in which the compare circuitry includes a serial test data inputand a serial test data output separate from the scan data input and thefirst input.
 10. The architecture of claim 7 in which the state machineoperates in the states of a Test Logic Reset state, a Run Test/Idlestate, Capture states, Shift states, Exit1 states, Pause states, Exit2states, and Update states.
 11. The architecture of claim 7 in which thegate circuitry is an AND gate.